Rapid Thermal Processing Substrate Temperature Uniformity
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Solution Overview
Problem
Current methods for optimizing rapid thermal processing (RTP) are time-consuming and expensive due to the need for processing and analyzing monitor substrates to ensure film thickness and sheet resistance uniformity.
Innovation Solution
A method and apparatus that measure substrate temperature uniformity by rotating the substrate within a thermal processing chamber, using multiple temperature probes to generate a temperature contour map, allowing for process optimization without the need for monitor substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If monitor substrates are processed and analyzed separately using stand alone metrology tools, then film uniformity can be measured, but the process becomes time-consuming and expensive
Solution Approach 1:
The patent combines the film uniformity measurement function with the existing rapid thermal processing tool by integrating optical measurement capabilities directly into the RTP chamber. This allows simultaneous processing and measurement, eliminating the need for separate metrology tools and reducing tool time while maintaining measurement precision.
Solution Approach 2:
The RTP tool is enhanced to perform multiple functions: thermal processing and film uniformity measurement. By making the RTP tool universal, it can serve both processing and characterization purposes, reducing the need for dedicated separate equipment and optimizing tool utilization.
2Manufacturing precision
If monitor substrates are used for process optimization, then process uniformity can be determined, but significant tool time is required
Solution Approach 1:
The system enables self-service measurement where the RTP tool measures its own processing uniformity in real-time during normal production runs. Production substrates serve dual purposes: they are processed and simultaneously used for measurement, eliminating the need for separate monitor substrates and maximizing productivity while maintaining manufacturing precision.
Solution Approach 2:
The measurement process occurs continuously during normal production processing rather than requiring separate dedicated measurement time. The optical system continuously monitors film uniformity throughout the thermal processing cycle, ensuring that useful action (both processing and measurement) continues without interruption.
3Measurement precision
If separate metrology tools are used for analysis, then accurate film measurements can be obtained, but the cost increases significantly
Solution Approach 1:
The patent merges the film uniformity measurement capability into the existing RTP tool structure by integrating optical measurement systems. This consolidation eliminates the need for multiple separate metrology tools, reducing device complexity and cost while preserving measurement precision through carefully positioned optical sensors that can accurately measure film properties during processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time or post-processing analysis of temperature data to identify uniformity issues and tool faults, reducing costs by eliminating the requirement for monitor substrates and providing immediate insights into process uniformity.
Implementation Method 1
a heat source adapted to apply heat to the substrate
Implementation Method 2
a plurality of temperature probes positioned with respect to the central assembly so as to measure temperature at a plurality of radial locations on the substrate
Data Source
AI summary
Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.