Thermocouple Kit for Rapid Thermal Processing
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Solution Overview
Problem
Conventional rapid thermal processing apparatuses face challenges in achieving precise temperature control and uniformity across large-area substrates due to limitations in non-contact temperature measurement accuracy and the complexity of hardware chamber design, leading to increased manufacturing costs and potential damage during substrate replacement.
Innovation Solution
A rapid thermal processing apparatus featuring a thermocouple kit with a feed-through and thermocouple substrate that extends into the chamber, allowing for indirect temperature measurement of the substrate using a thermocouple wire without direct contact, and includes insulators to prevent heat transfer and a support rod system for easy installation and removal, ensuring accurate and efficient temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a non-contact temperature measurement method using a pyrometer is used, then damage to the substrate is reduced, but real-time measurement accuracy is low
Solution Approach 1:
A thermocouple substrate is introduced as an intermediary element that thermally couples to the processed substrate. The thermocouple substrate transfers thermal information from the substrate to the thermocouple wire, enabling accurate temperature measurement without direct contact between the thermocouple and the substrate, thus avoiding substrate damage while maintaining measurement accuracy.
2Measurement precision
If a thermocouple wire is directly mounted to the substrate, then temperature measurement accuracy is improved, but the substrate is damaged
Solution Approach 1:
The thermocouple substrate serves as a mediator between the thermocouple wire and the processed substrate. It provides a mounting surface for the thermocouple wire while maintaining thermal coupling to the substrate through radiation or conduction, enabling accurate measurement without mechanical contact that would damage the substrate.
3Device complexity
If the substrate is fixed in the chamber without rotation, then the apparatus complexity is reduced, but temperature uniformity across the substrate is poor
Solution Approach 1:
The substrate is rotated periodically during the rapid thermal processing cycle, exposing different regions to the heat source at different times. This periodic rotation ensures that the entire substrate surface receives uniform thermal energy, improving temperature uniformity across the substrate while maintaining a relatively simple fixed chamber design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high-accuracy real-time temperature measurement of substrates with reduced risk of damage and improved work efficiency by using a thermocouple kit that attaches and detaches easily, enhancing the quality and reliability of the rapid thermal processing process.
Implementation Method 1
a bonding portion of the thermocouple wire is located at the thermocouple substrate extending into the chamber
Implementation Method 2
an insulator may be located between the thermocouple substrate and an inner surface of the support rod to block heat transfer between the thermocouple substrate and the support rod
Implementation Method 3
a heat source device 20 disposed at an inner upper side of the chamber 10 to rapidly heat the rapid thermal processing substrate 1 by radiating light
Data Source
AI summary
The present disclosure relates to a rapid thermal processing apparatus for rapid heat treatment of a substrate, and particularly, to increasing the accuracy in measuring the temperature of a substrate to be thermally processed by configuring a thermocouple for measuring the temperature of the substrate under the same conditions as the substrate to be thermally processed so as to be attached to and detached from the chamber, and the present disclosure provides a rapid thermal processing apparatus having a thermocouple installed to measure a temperature of a substrate to be thermally processed located inside a chamber, and the rapid thermal processing apparatus includes a mounting hole formed in the chamber, and a thermocouple kit inserted into and mounted to the mounting hole so that a bonding portion of a thermocouple wire is located at a thermocouple substrate extending into the chamber.