Rare Earth Oxyfluoride Plasma Spray Coating for Semiconductor Etching
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Solution Overview
Problem
Conventional thermal spray materials like aluminum and chromium oxides are inadequate for semiconductor manufacturing due to corrosion susceptibility in halogen-based plasma atmospheres, and rare earth element fluoride coatings decompose at high temperatures, limiting their practical use.
Innovation Solution
A thermal spray material comprising rare earth element oxyfluoride particles with specific size, density, and composition, allowing for plasma spraying with minimal decomposition and high corrosion resistance, formed by mixing rare earth element oxide and fluoride particles and agglomerating them with a binder before firing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rare earth element fluoride is used as spray material, then corrosion resistance is improved, but decomposition occurs at high temperatures during plasma spraying
Solution Approach 1:
The patent uses composite rare earth element oxyfluoride particles combining oxide and fluoride components. This composite structure provides both the corrosion resistance of fluoride and the thermal stability of oxide, resolving the contradiction between these two properties.
Solution Approach 2:
The patent modifies the chemical composition parameters by controlling oxygen and fluorine content ratios in the oxyfluoride particles. By adjusting these parameters, the material achieves optimal balance between corrosion resistance and thermal stability during plasma spraying.
2Ease of manufacture
If conventional oxide materials like aluminum and chromium are used, then ease of manufacture is improved, but corrosion resistance in halogen-based plasma atmosphere deteriorates
Solution Approach 1:
The patent changes the chemical composition from conventional oxides to rare earth element oxyfluorides with specific oxygen and fluorine content ratios. This parameter change provides both corrosion resistance in halogen-based plasma and maintains ease of manufacture through plasma spraying processes.
3Ease of manufacture
If rare earth element oxide is used as spray material, then ease of manufacture is improved, but corrosion resistance in halogen-based plasma atmosphere deteriorates
Solution Approach 1:
The patent employs composite rare earth element oxyfluoride particles that integrate the manufacturing ease of oxides with the corrosion resistance of fluorides, achieving both objectives simultaneously.
Solution Approach 2:
By adjusting the oxygen and fluorine content parameters in the oxyfluoride composition, the patent achieves optimal balance between ease of manufacture through plasma spraying and corrosion resistance in halogen-based plasma environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The rare earth element oxyfluoride spray material provides higher corrosion resistance and longer lifetime against plasma etching, outperforming traditional oxide and fluoride coatings in semiconductor fabrication environments.
Implementation Method 1
plasma spraying the rare earth element oxyfluoride spray material onto a substrate
Implementation Method 2
sprayed coatings having higher corrosion resistance than conventional sprayed coatings of rare earth element oxide or fluoride
Data Source
AI summary
A spray material comprising rare earth element oxyfluoride particles having an aspect ratio of up to 2, an average particle size of 10-100 μm, and a bulk density of 0.8-2 g/cm3, and containing not more than 0.5 wt % of carbon and 3-15 wt % of oxygen is suitable for air plasma spraying. An article having a sprayed coating of rare earth element oxyfluoride has high resistance against plasma etching and a long lifetime.