Rare Earth Oxyhalide Thermal Spray Coating for Plasma Erosion Resistance
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Solution Overview
Problem
Conventional thermal spray coatings used in semiconductor manufacturing lack sufficient plasma erosion resistance, leading to potential contamination and circuit defects due to particle deposition from exposed equipment components during halogen and oxygen gas plasma exposure.
Innovation Solution
A thermal spray material comprising at least 77% by mass of rare earth element oxyhalide (RE—O—X), specifically designed to be essentially free of rare earth element oxides, providing enhanced plasma erosion resistance through a high halogen content and balanced molar ratios, thereby forming a coating with improved resistance to halogen plasma.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal spray materials (such as yttrium oxide) are used to coat equipment surfaces, then the coating provides basic plasma erosion resistance, but the resistance is insufficient to prevent particle formation and contamination in semiconductor manufacturing environments
Solution Approach 1:
The patent changes the chemical composition parameters of the thermal spray material by incorporating rare earth element oxyhalides (containing halogen atoms such as fluorine, chlorine, or bromine) in specific ratios. This compositional parameter change enables the coating to form a more stable surface layer under plasma exposure, reducing particle formation while maintaining erosion resistance.
Solution Approach 2:
The patent uses composite thermal spray materials containing multiple rare earth element oxyhalides or combinations of rare earth element oxyhalides with other ceramic materials. This composite approach creates a coating with synergistic properties that simultaneously achieve high plasma erosion resistance and low particle generation, resolving the contradiction between durability and contamination control.
2Duration of action of stationary object
If the thermal spray coating is made more erosion resistant to withstand halogen plasma, then the coating durability improves, but the risk of particle deposition on semiconductor substrates increases
Solution Approach 1:
The patent optimizes the halogen content ratio in the rare earth element oxyhalide composition. By controlling the halogen to rare earth element molar ratio within specific ranges, the coating achieves a balance where it remains durable under plasma exposure while minimizing the formation and deposition of particles on semiconductor substrates.
Solution Approach 2:
The patent creates a coating with differentiated properties: the surface layer is engineered to be highly resistant to plasma erosion, while the bulk composition is optimized to minimize particle generation. This local quality differentiation allows the coating to simultaneously achieve durability and low contamination, resolving the contradiction between long-term durability and particle deposition prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal spray coating exhibits superior plasma erosion resistance, reducing particle formation and deposition on semiconductor substrates, maintaining high quality and precision in semiconductor device manufacturing by minimizing particle contamination.
Implementation Method 1
thermal spray technology where a substrate surface is thermal-sprayed with particles formed with a material such as ceramic softened or melted by combustion or electrical energy
Data Source
AI summary
This invention provides a thermal spray material capable of forming a thermal spray coating with greater plasma erosion resistance. The thermal spray material comprises at least 77% by mass rare earth element oxyhalide (RE—O—X) which comprises a rare earth element (RE), oxygen (O) and a halogen atom (X) as its elemental constituents. The thermal spray material is characterized by being essentially free of an oxide of the rare earth element.