RCLED Lamp Bead Anti-Reflection Adhesive Packaging
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Solution Overview
Problem
Traditional LED lamp bead packaging processes fail to eliminate the reflection effect caused by light being reflected by the lens and bonding wire in RCLED lamp beads, leading to ghosting and a decrease in the clarity and accuracy of the light spot.
Innovation Solution
A RCLED lamp bead packaging process involving the use of anti-reflection adhesives, where a first layer covers the functional area and a second layer covers the bonding wire and PAD, while ensuring the light-emitting hole remains uncovered, combined with precise dispensing and controlled viscosity to minimize reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional LED lamp bead packaging process is used, then production is simple and efficient, but reflection effect occurs causing ghosting and reduced light spot clarity
Solution Approach 1:
The patent introduces anti-reflection adhesive as an intermediary substance between the lens and the RCLED chip. This adhesive layer absorbs and eliminates the reflection effect that occurs when light passes through the lens, thereby preventing ghosting and improving light spot clarity without fundamentally changing the packaging process structure
Solution Approach 2:
The anti-reflection adhesive is applied selectively to specific areas: the first layer covers the functional area (bonding wire and PAD) while the second layer covers the lens surface, but the light-emitting hole remains uncovered. This localized application ensures reflection elimination while maintaining light emission functionality
2Object-affected harmful factors
If anti-reflection adhesive is applied to cover functional areas, then reflection effect is eliminated, but adhesive may block light-emitting hole reducing light output
Solution Approach 1:
The patent employs a two-layer anti-reflection adhesive application method where the first layer targets the functional area (bonding wire and PAD) and the second layer targets the lens surface, while deliberately leaving the light-emitting hole uncovered. This selective local application ensures that reflection is eliminated from areas where it causes harm while maintaining unobstructed light emission path
Solution Approach 2:
The patent applies anti-reflection adhesive partially - only to the extent necessary to cover the functional area and lens surface, avoiding excessive application that would block the light-emitting hole. The controlled dispensing ensures sufficient coverage for reflection elimination while preventing light blockage
3Manufacturing precision
If precise dispensing control is implemented for anti-reflection adhesive, then adhesive application accuracy improves, but production time increases
Solution Approach 1:
The patent adjusts the viscosity of the anti-reflection adhesive to an optimal range (1000-5000 cP) before dispensing. This preliminary viscosity adjustment enables the adhesive to flow and spread automatically to the required areas, reducing the need for complex real-time dispensing control and thereby maintaining production efficiency while achieving precise coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively eliminates the reflection effect, improving the clarity and precision of the light spot emitted by RCLED lamp beads by precisely controlling the anti-reflection adhesive application and viscosity, ensuring efficient production while reducing adhesive thickness and cost.
Implementation Method 1
a part of the RCLED lamp bead being able to make a reflection is covered, the reflective effect of the RCLED lamp bead is eliminated effectively
Implementation Method 2
baking to solidify the die-bonding glue, and the die-bonding glue combines with a plurality of pins of the RCLED chip tightly to fix the RCLED chip
Implementation Method 3
welding a bonding wire to connect the lamp bead bracket to the PAD
Implementation Method 4
the RCLED chip comprises a light-emitting hole and a PAD
Data Source
AI summary
Disclosed are RCLED lamp bead packaging process and RCLED lamp bead, which comprises steps of: dispensing a die-bonding glue, mounting a chip, baking, welding a bonding wire, dispensing a first layer of anti-reflection adhesive, baking, dispensing a second layer of anti-reflection adhesive, baking, and testing. Anti-reflection adhesive is dispensed in corresponding area to cover part capable of reflecting light in RCLED lamp bead and eliminate reflection effect effectively. The first layer of anti-reflection adhesive fills in specified area rapidly to achieve high production efficiency. The second layer of anti-reflection adhesive flows slowly after glue dispensing, so that the glue dispensing precision is improved and the light-emitting hole is prevent from being covered. When bonding wire is welded, a bracket is the first welding spot and a PAD of the chip is the second welding spot to achieve a lower radian of the bonding wire.