RDL Adhesion Layer Layout for TIV-Induced Delamination

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Solution Overview

Problem

Delamination between redistribution layers (RDLs) and polymer layers in semiconductor device packages occurs due to thermal expansion of through insulator vias, leading to electrical shorting and reduced yield.

Innovation Solution

Incorporation of an adhesion layer over portions of the RDLs in the shadow of through insulator vias to enhance adhesion between RDLs and polymer layers, reducing the likelihood of delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through insulator vias are formed in the redistribution structure, then electrical connectivity is achieved, but thermal expansion causes delamination between RDLs and polymer layers

Engineering Contradiction:

Improveelectrical connectivityVSAvoidadhesion between RDL and polymer layer

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

An adhesion layer is introduced as an intermediary between the RDL and polymer layer. This adhesion layer specifically addresses the interface where delamination occurs due to thermal expansion of through insulator vias, maintaining both electrical connectivity and structural stability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesion layer is applied selectively to specific regions rather than uniformly across the entire structure. This localized application targets areas prone to delamination while minimizing additional complexity and material usage.

Inventive Principle:

Principle #3Local quality

2Reliability

If adhesion layer is added to prevent delamination, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improveprevention of delaminationVSAvoidnumber of layers in redistribution structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces the likelihood of electrical shorting and increases semiconductor device package yield by preventing delamination caused by thermal stress.

Implementation Method 1

Delamination between redistribution layers (RDLs) and polymer layers in semiconductor device packages occurs due to thermal expansion of through insulator vias

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250364391A1Semiconductor device package and methods of formation

Publication Date: 2025.11.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An adhesion layer may be formed over portions of a redistribution layer (RDL) in a redistribution structure of a semiconductor device package. The portions of the RDL over which the adhesion layer is formed may be located in the “shadow” of (e.g., the areas under and/or over and within the perimeter of) one or more TIVs that are connected with the redistribution layer structure. The adhesion layer, along with a seed layer on which the portions of the RDL are formed, encapsulate the portions of the RDL in the shadow of the one or more TIVs, which promotes and/or increases adhesion between the portions of the RDL and the polymer layers of the redistribution structure.