Semiconductor Package Antenna Integration in RDL

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Solution Overview

Problem

Conventional semiconductor packages with integrated antennas face challenges in miniaturization, increased height, and reliability due to the need for additional PCB space and potential delamination issues during surface mount technology (SMT) processes.

Innovation Solution

A semiconductor package assembly with an antenna pattern integrated into a single redistribution layer (RDL) structure, where the antenna is embedded within the RDL and electrically connected through conductive traces, eliminating the need for SMT and allowing for reduced package size and improved reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a discrete antenna component is mounted on a PCB or package using SMT, then wireless communication functionality is achieved, but the package size increases and additional PCB area is required

Engineering Contradiction:

Improvewireless communication functionalityVSAvoidpackage size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The antenna is merged with the RDL structure by forming the antenna pattern on the same substrate as the redistribution layer. The RDL substrate serves dual purposes: as the mounting platform for semiconductor devices and as the antenna structure itself, eliminating the need for separate antenna components and reducing overall package size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The RDL substrate is designed to perform multiple functions simultaneously: it acts as the mechanical support for semiconductor devices, provides electrical interconnection through conductive traces, and functions as the antenna structure for wireless communication. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If a discrete antenna component is mounted on the package using SMT, then wireless communication is enabled, but the total height of the SiP structure increases

Engineering Contradiction:

Improvewireless communication functionalityVSAvoidpackage height

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The antenna is integrated into the RDL substrate rather than being mounted as a separate component on top of the package. This merging eliminates the additional height that would be required for a discrete antenna component and its mounting structure, resulting in a lower overall package profile.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If a discrete antenna component is mounted using SMT, then wireless communication functionality is achieved, but delamination may occur between the antenna component and underlying package

Engineering Contradiction:

Improvewireless communication functionalityVSAvoidbonding reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The antenna is formed as an integral part of the RDL substrate using the same fabrication processes as the redistribution layer. This integration eliminates the bonding interface between separate antenna and package components, removing the risk of delamination that occurs with SMT-mounted antenna components.

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If conventional SMT processes are used for antenna mounting, then wireless communication is enabled, but manufacturing complexity and potential delamination issues increase

Engineering Contradiction:

Improvewireless communication functionalityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The antenna fabrication is merged with the RDL manufacturing process, using the same sequence of steps: forming the substrate, depositing conductive traces, and applying protective layers. This integration eliminates separate SMT processing steps and reduces manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11728292B2Semiconductor package assembly having a conductive electromagnetic shield layer

Publication Date: 2023.08.15 MEDIATEK INC

AI summary

The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The first RDL structure includes a plurality of first conductive traces close to the first surface of the first RDL structure. An antenna pattern is disposed close to the second surface of the first RDL structure. A first semiconductor die is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. A plurality of conductive structures is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. The plurality of conductive structures is spaced apart from the antenna pattern through the plurality of first conductive traces of the first RDL structure.