Redistribution Layer Extension for I/O Pad Density
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Solution Overview
Problem
Conventional semiconductor packaging technologies face challenges in efficiently increasing the number of input/output (I/O) pads on a die surface area and integrating discrete devices for enhanced thermal, structural, and electrical performance.
Innovation Solution
The formation of redistribution layers (RDLs) over a die, extending past its edges, and the use of discrete devices with connectors on both surfaces to bond and connect to package components, serving as interconnects, thermal paths, and structural supports, thereby increasing the I/O pads' surface area and improving package integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If redistribution layers (RDLs) are formed over a die and extended past its edges to increase I/O pad surface area, then the number of I/O pads that can be packed is increased, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extends the redistribution layers (RDLs) beyond the die edges into the molding compound, utilizing the vertical and lateral dimensions to create additional I/O pad locations. This dimensional extension allows I/O pads to be distributed over a larger area without increasing die size, effectively resolving the contradiction between increasing I/O pad quantity and maintaining manageable device complexity.
Solution Approach 2:
The package structure is segmented into distinct functional zones: the die area, the RDL extension area within the molding compound, and the discrete device mounting area. This segmentation allows each region to serve specific purposes - the die for active components, the RDL extensions for additional I/O pads, and the discrete devices for thermal and structural functions - thereby managing complexity through functional separation.
2Temperature
If discrete devices are integrated into the package for enhanced thermal and structural performance, then thermal management and structural integrity are improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The discrete devices mounted on the package serve multiple functions simultaneously: they act as thermal management components (heat sinks or heat spreaders), structural supports for the package, and mounting platforms for additional electronics. This multi-functionality allows a single integration step to address thermal, structural, and functional requirements, reducing the net increase in device complexity.
Solution Approach 2:
The patent combines thermal management, structural support, and electronic functionality into a single integrated package structure. The molding compound encapsulates both the die and discrete devices, creating a unified assembly where thermal paths, structural elements, and electrical interconnects are integrated rather than separate, thereby managing complexity through consolidation.
3Reliability
If connectors are formed on both top and bottom surfaces of discrete devices to bond to package components, then electrical connectivity and structural integrity are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The molding compound acts as an intermediary medium that provides mechanical support and alignment reference for the connectors on discrete devices. By embedding the discrete devices within the molded structure, the compound creates a stable reference framework that facilitates precise connector alignment during subsequent bonding processes, thereby reducing manufacturing precision requirements.
Solution Approach 2:
The discrete devices are mounted and connected to the package structure before the final molding step. This preliminary action allows the connectors to be positioned and preliminarily aligned while the devices are accessible, and the subsequent molding process locks them in place, ensuring precise final alignment without requiring high precision during the most critical bonding operations.
Data Source
AI summary
An embodiment device package includes a discrete device, a first connector on a bottom surface of the discrete device, and a second connector on a top surface of the discrete device. The first connector bonds the discrete device to a first package component, and the second connector bonds the discrete device to a second package component.