Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer
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Solution Overview
Problem
Conventional electronic packages and manufacturing methods result in excessive costs, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device structure comprising a base substrate with a conductive structure, a vertical interconnect, an encapsulant, and an interposer substrate with a conductive structure, where the interposer substrate is either a redistribution layer (RDL) or a laminate substrate, and the use of a method that includes providing a base substrate, a vertical interconnect, an encapsulant, and an interposer substrate with a conductive structure, ensuring electrical routing and protection for electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronic packages and manufacturing methods are used, then manufacturing simplicity is maintained, but cost increases excessively and reliability decreases
Solution Approach 1:
The electronic package is divided into distinct functional layers including base substrate, encapsulant, and interposer substrate, each with specific manufacturing processes. This segmentation allows specialized fabrication techniques for each layer while maintaining overall manufacturing feasibility through standardized assembly procedures.
Solution Approach 2:
An interposer substrate is introduced as an intermediary component between the base substrate and the final device assembly. This interposer provides a transition layer that improves signal integrity and electrical connections, thereby enhancing reliability while being integrated into the manufacturing flow through vertical interconnect formation.
2Area of stationary object
If conventional electronic packages are used, then manufacturing process simplicity is maintained, but package size becomes too large
Solution Approach 1:
The package structure transitions from a planar two-dimensional layout to a three-dimensional vertical architecture by stacking the base substrate, encapsulant, and interposer substrate vertically. This dimensional change reduces the footprint area while maintaining manufacturing simplicity through vertical interconnect formation and layer-by-layer assembly processes.
3Productivity
If conventional electronic packages are used, then manufacturing simplicity is maintained, but performance decreases
Solution Approach 1:
The invention modifies key electrical parameters by implementing controlled impedance routing and optimized signal paths through the vertical interconnect structure. This changes the electrical characteristics to improve signal integrity and device performance while maintaining manufacturing simplicity through standardized fabrication processes for the vertical interconnects and conductive structures.
Data Source
AI summary
In one example, an electronic device comprises a base substrate comprising a base substrate conductive structure, a first electronic component over a first side of the base substrate, an encapsulant over the first side of the base substrate, wherein the encapsulant contacts a lateral side of the electronic component, an interposer substrate over a first side of the encapsulant and comprising an interposer substrate conductive structure, and a vertical interconnect in the encapsulant and coupled with the base substrate conductive structure and the interposer substrate conductive structure. A first one of the base substrate or the interposer substrate comprises a redistribution layer (RDL) substrate, and a second one of the base substrate or the interposer substrate comprises a laminate substrate. Other examples and related methods are also disclosed herein.