RDL Package Structure With Adhesive Layer for Die Warpage Control
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Solution Overview
Problem
Conventional semiconductor packages face issues with die warpage and reduced bonding strength due to stress during thermal compression bonding, and mismatched solder bumps, which hinder the enhancement of signal transmission rate and power density.
Innovation Solution
The use of an adhesive layer to adhere a redistribution layer (RDL) and an electronic component, with the adhesive layer surrounding upper bumps on the RDL and being adhered to both the RDL and the electronic component's active surface, enhancing bonding strength through thermal compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal compression bonding is used to bond dies and RDL, then bonding is achieved, but stress causes die warpage and reduces bonding strength
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the RDL and the electronic component. This adhesive layer acts as a stress buffer that absorbs and distributes the thermal and mechanical stress during compression bonding, preventing die warpage while maintaining strong bonding. The adhesive layer mediates the interface between components, allowing for reliable bonding without the harmful effects of direct stress transmission.
2Strength
If solder bumps on die and bonding bumps of RDL are used for bonding, then electrical connection is achieved, but bump mismatch reduces contacting area and bonding strength
Solution Approach 1:
The adhesive layer serves as a compensating intermediary that can accommodate slight misalignments between solder bumps on the die and bonding bumps on the RDL. By providing a compliant bonding interface, the adhesive layer ensures adequate contact area even when bump positioning varies within manufacturing tolerances, thereby maintaining bonding strength despite alignment challenges.
3Productivity
If conventional package structure is used, then manufacturing is simpler, but signal transmission rate and power density are limited
Solution Approach 1:
The package structure is segmented into distinct functional layers including the RDL, adhesive layer, and electronic component with separately formed conductors and bonding structures. This segmentation allows for optimized signal transmission paths and improved power density while maintaining manufacturability through standardized processing steps for each layer.
Solution Approach 2:
The invention transitions from planar bonding to a three-dimensional structure with vertical stacking of RDL, adhesive layer, and electronic component. This dimensional change enables increased signal transmission rate and power density by utilizing vertical space for multiple bonding interfaces and conductive paths, while the adhesive layer provides the necessary compliance for reliable bonding in this stacked configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the adhesive strength between the RDL and the electronic component, enabling more complex and compact package designs with increased signal transmission rate and power density.
Implementation Method 1
the adhesive layer is adhered to the first upper surface of the first RDL and the active surface of the first electronic component
Implementation Method 2
The first electronic component is bonded to the first RDL by thermal compression to allow the conductors to be joined to the upper bumps
Data Source
AI summary
A package structure includes a first RDL, an adhesive layer and a first electronic component. Upper bumps and conductive pads are provided on a first upper surface and a first lower surface of the first RDL, respectively. The adhesive layer is located on the first upper surface of the first RDL and surrounds the upper bumps. The first electronic component is mounted on the adhesive layer and includes conductors which are visible from an active surface of the first electronic component and joined to the upper bumps, the active surface of the first electronic component faces toward the first upper surface of the first RDL. Two adhesive surfaces of the adhesive layer are adhered to the first upper surface of the first RDL and the active surface of the first electronic component, respectively.