Redistribution Line Patterning for High-Speed Package Stacking
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Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices exceeding one TeraHertz, with limitations in assembly, cooling, reliability, and cost-effectiveness, particularly in achieving smaller footprints and robust packages for portable electronics.
Innovation Solution
The development of an integrated circuit package system that includes an internal device encapsulated with a redistribution line (RDL) on its outer surface, which conducts electrical signals and connects external devices, addressing the need for efficient signal routing and assembly in compact forms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If current packaging technologies are used for high-speed devices exceeding one TeraHertz, then device performance can be maintained, but assembly challenges, cooling issues, and reliability problems increase significantly
Solution Approach 1:
The patent transitions from planar interconnection to three-dimensional vertical stacking with multiple encapsulation layers and redistribution lines at different heights, enabling high-speed signal transmission while improving thermal management and assembly reliability through spatial separation of components
2Area of moving object
If device density is increased to reduce footprint size, then portable electronics become more compact, but manufacturing precision and assembly difficulty increase
Solution Approach 1:
The package is segmented into multiple discrete encapsulation layers with redistribution lines at different levels, allowing independent fabrication and alignment of each layer, which reduces the cumulative precision requirements compared to monolithic high-density designs
Solution Approach 2:
Encapsulation materials serve as intermediary layers between internal devices and external connections, providing mechanical support, electrical isolation, and alignment tolerance that facilitates high-density packaging without proportionally increasing manufacturing precision requirements
3Adaptability or versatility
If more components with varied environmental needs are incorporated, then device functionality is enhanced, but manufacturing complexity and error risk increase greatly
Solution Approach 1:
The encapsulation structure serves multiple functions simultaneously: mechanical protection, electrical isolation, thermal management, and environmental sealing, allowing diverse components with different environmental requirements to be integrated without proportionally increasing manufacturing complexity
Data Source
AI summary
An integrated circuit package system includes: providing an internal device; encapsulating the internal device with an encapsulation having an outer surface; and forming a redistribution line having connection points on the outer surface of the encapsulation.