RDL-Stacked Electronic Assembly for Fewer Routing Layers
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Solution Overview
Problem
The increasing complexity of electronic apparatuses and line width/pitch limitations in semiconductor manufacturing make it difficult to manufacture active assemblies on substrates, leading to larger sizes and higher manufacturing costs due to the need for multi-layered routing structures.
Innovation Solution
The development of an electronic apparatus with a transistor circuit and single-sided or double-sided redistribution layer (RDL) routing, utilizing a first and second metal layer, and a PN junction assembly, which reduces the number of layers required and enables efficient electrical connections through a manufacturing method involving a carrier substrate and insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-layered routing structure is used to dispose active assembly on circuit substrate, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent transitions from planar multi-layered routing to three-dimensional vertical stacking architecture. Active assemblies are stacked vertically with redistribution layers (RDL) on opposite sides of insulating layers, enabling electrical connections through vertical vias rather than horizontal multi-layer routing. This dimensional change reduces the number of required layers and simplifies the overall routing structure while maintaining reliable electrical connectivity.
2Ease of manufacture
If multi-layered routing structure is manufactured, then active assembly can be disposed, but manufacturing cost increases
Solution Approach 1:
The patent employs vertical stacking with RDLs on opposite sides of insulating layers to eliminate the need for complex multi-layer horizontal routing. This approach reduces manufacturing steps and material requirements while enabling active assembly disposal, thereby lowering manufacturing cost and simplifying the routing structure simultaneously.
3Ease of manufacture
If conventional circuit substrate with multi-layer routing is used, then active assembly is disposed, but size of electronic apparatus increases
Solution Approach 1:
The patent utilizes vertical stacking architecture where active assemblies are arranged in three-dimensional space with RDLs on opposite sides of insulating layers. This vertical arrangement significantly reduces the planar footprint compared to conventional horizontal multi-layer routing, enabling compact electronic apparatus design while maintaining ease of active assembly disposal.
Data Source
AI summary
The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.