RDL-to-Substrate Interconnect Structure for Fine-Pitch Packaging
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Solution Overview
Problem
Conventional wafer manufacturers aim to scale up chip feature sizes using redistribution layers (RDL), while substrate manufacturers struggle to maintain precision and reduce feature size simultaneously, posing a challenge in the semiconductor industry.
Innovation Solution
The proposed solution involves an electronic device with a redistribution structure featuring a redistribution layer trace, a substrate with a substrate trace, an adhesion layer, and conductive members that electrically connect the RDL trace to the substrate trace, facilitating flexibility and precision in substrate and component combination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wafer manufacturers scale up chip feature size through RDL, then chip functionality is enhanced, but substrate precision and feature size reduction cannot be maintained simultaneously
Solution Approach 1:
The invention divides the substrate structure into multiple functional layers: a substrate providing mechanical support, an adhesion layer for bonding, a redistribution layer (RDL) for signal routing, and conductive members for electrical connection. This segmentation allows each layer to be optimized independently - the substrate for precision and the RDL for functionality.
Solution Approach 2:
The adhesion layer acts as an intermediary between the substrate and the redistribution structure, enabling reliable bonding while allowing independent optimization of each component. The conductive members serve as intermediaries to establish electrical connections between the RDL and substrate traces.
2Manufacturing precision
If substrate manufacturers reduce feature size, then precision is enhanced, but flexibility in combination with substrates and components is limited
Solution Approach 1:
By segmenting the electronic device into separate functional modules (substrate, adhesion layer, redistribution structure), the invention enables high-precision substrate manufacturing while maintaining flexibility in assembling different components and configurations.
Solution Approach 2:
The substrate serves multiple functions: providing mechanical support, enabling precise feature fabrication, and serving as a platform for assembling different redistribution structures and components. The modular design allows the same substrate to be combined with various configurations.
3Ease of manufacture
If conventional wafer package and substrate combination is used, then manufacturing process is simplified, but both benefits of substrate precision and feature size reduction cannot be maintained
Solution Approach 1:
The invention segments the manufacturing process into distinct stages: substrate preparation, adhesion layer formation, redistribution structure fabrication, and assembly. This allows each stage to be optimized for its specific requirements, maintaining precision while managing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables substrate manufacturers to achieve flexibility and precision while reducing feature size, enhancing the precision of substrates and combining benefits with wafer packages, which is crucial in the semiconductor industry.
Implementation Method 1
an adhesion layer attaching the redistribution structure to the substrate
Implementation Method 2
conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.