Redistribution Layer Test Pattern for Through-Hole Alignment Control
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Solution Overview
Problem
In packaging technology, the varying stacking thickness of redistribution structures makes it difficult to ensure through holes penetrate uniformly across a substrate, and there is a lack of real-time inline inspection for the quality of patterned through holes in redistribution layers.
Innovation Solution
A package device with a redistribution layer comprising a first dielectric layer, a conductive layer, and a second dielectric layer, where the conductive layer is between the first and second dielectric layers, and includes a test pattern with a through hole that overlaps the conductive pattern, allowing for real-time inspection of patterning processes by measuring the alignment and exposure of the conductive pattern within the dielectric pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging processes are used with varying dielectric layer thickness, then manufacturing flexibility is maintained, but through hole penetration consistency deteriorates
Solution Approach 1:
The patent applies preliminary action by forming a test pattern structure before the actual through hole formation process. The test pattern includes a through hole and conductive pattern that are formed in advance to establish reference data for subsequent inspection processes, enabling prediction and compensation of through hole penetration quality before mass production
Solution Approach 2:
The patent implements feedback by using the test pattern results to provide real-time information about dielectric layer thickness and through hole penetration quality. This feedback mechanism allows the manufacturing process to adjust parameters dynamically, ensuring consistent through hole penetration even when dielectric layer thickness varies across different substrate positions
2Reliability
If real-time inspection of through holes is implemented, then process quality control improves, but manufacturing time increases
Solution Approach 1:
The test pattern is formed in advance during the same manufacturing steps as the actual structure, so that inspection data is available without adding separate inspection time. The conductive pattern and through hole in the test pattern are created simultaneously with the main structure, enabling inline quality assessment
Solution Approach 2:
The test pattern structure serves itself by providing built-in reference data for inspection. The conductive pattern within the test pattern's through hole automatically provides the reference signal needed for inspection systems to assess through hole penetration quality, eliminating the need for external calibration standards or additional measurement steps
Data Source
AI summary
A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.