RDS Semiconductor Package Structure for Fine-Pitch Signal Redistribution
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device structure that includes a base substrate with a conductive structure, encapsulants, a redistribution structure (RDS) substrate with conductive and dielectric layers, and electronic components, where the RDS substrate is used to redistribute signals and provide a finer pitch than the base substrate, and encapsulants protect the components from environmental exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing cost is reduced, but reliability decreases and package size increases
Solution Approach 1:
The patent implements a nested structure where the first electronic component is positioned over the base substrate, the RDS substrate is positioned over the first electronic component, and the second electronic component is positioned over the RDS substrate. This vertical stacking arrangement allows multiple functional layers to be integrated within a compact footprint, improving reliability through better signal distribution while minimizing package size.
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional vertical architecture by stacking the base substrate, first electronic component, RDS substrate, and second electronic component in the vertical dimension. This dimensional change enables higher integration density and improved electrical connectivity without increasing the lateral package footprint.
2Productivity
If conventional semiconductor packages are used, then manufacturing simplicity is maintained, but performance decreases
Solution Approach 1:
The patent divides the semiconductor package into distinct functional segments: base substrate for mechanical support, first electronic component for primary functionality, RDS substrate for signal redistribution, and second electronic component for additional functionality. This segmentation allows each layer to be optimized independently for its specific function, enhancing overall device performance while maintaining manufacturability through modular assembly.
Solution Approach 2:
The RDS substrate serves multiple functions simultaneously: it redistributes electrical signals from the base substrate to the second electronic component, provides mechanical support for the second electronic component, and enables fine-pitch interconnections. This multi-functionality improves device performance without proportionally increasing manufacturing complexity.
3Reliability
If conventional packages are used, then cost is reduced, but electrical connectivity and protection are insufficient
Solution Approach 1:
The RDS substrate acts as an intermediary layer between the base substrate and the second electronic component, providing fine-pitch signal redistribution and enabling reliable electrical connectivity. This intermediary structure allows standard packaging processes to achieve enhanced connectivity and protection without substantially increasing manufacturing cost.
Data Source
AI summary
In one example, a semiconductor device comprises a first base substrate comprising a first base conductive structure, a first encapsulant contacting a lateral side of the first base substrate, a redistribution structure (RDS) substrate over the base substrate and comprising an RDS conductive structure coupled with the first base conductive structure, a first electronic component over the RDS substrate and over a first component terminal coupled with the RDS conductive structure, and a second encapsulant over the RDS substrate and contacting a lateral side of the first electronic component. Other examples and related methods are also disclosed herein.