Reaction Chamber Gas Diffusion Plate for Etching Uniformity
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Solution Overview
Problem
The loading effect in dry etching, where differences in etched surface shape and density lead to non-uniform etching rates and quality, due to varying plasma consumption across different pattern areas.
Innovation Solution
A reaction chamber with a gas diffusion plate and adjustment assembly that allows for real-time adjustment of air hole ventilation areas, enabling precise control of plasma concentration over etched patterns, reducing the loading effect and improving etching uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a uniform gas distribution plate is used, then the structure is simple, but the etching uniformity deteriorates due to loading effect
Solution Approach 1:
The gas distribution plate is divided into multiple regions with different ventilation area characteristics. Each region has air holes with ventilation areas specifically designed for that location, creating non-uniform gas distribution that compensates for the loading effect. This local differentiation improves etching uniformity across the substrate surface.
Solution Approach 2:
The gas distribution plate is segmented into multiple independent regions, each with its own set of air holes and ventilation characteristics. This segmentation allows independent optimization of gas flow to different areas of the substrate, addressing the loading effect in each region separately and improving overall etching uniformity.
2Quantity of substance
If the ventilation area is increased for large etched areas, then the plasma concentration can be maintained, but the device complexity increases
Solution Approach 1:
The ventilation areas of the air holes are pre-calculated and pre-configured based on the expected etching patterns and loading effects. This preliminary design eliminates the need for real-time adjustment mechanisms, maintaining plasma concentration while avoiding complex adjustment devices. The system is optimized in advance rather than requiring dynamic control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively balances plasma concentration across different etched patterns, enhancing etching uniformity and quality by automating adjustments based on real-time detection of etching rates.
Implementation Method 1
a gas diffusion plate... configured to introduce a process gas into the cavity
Implementation Method 2
uses a plasma generated in a gaseous state... for physical and chemical reactions with silicon wafer or glass substrate
Implementation Method 3
Dry etching is a process technology that uses a plasma generated in a gaseous state
Data Source
AI summary
Disclosed herein is a reaction chamber comprising a cavity, an upper electrode disposed in the cavity, a gas diffusion plate, and an adjustment assembly, wherein the gas diffusion plate is disposed directly above the upper electrode, and blocks the cavity, and the gas diffusion plate is provided with a plurality of air holes; the adjustment assembly is disposed on the gas diffusion plate.