Reaction Chamber Laser Fixture for Precise Target Positioning

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Solution Overview

Problem

Existing semiconductor processing systems face challenges in maintaining consistent gas flow and thermal conditions due to deviations in the positioning of structures within reaction chambers, leading to variations in film thickness and electrical properties during film deposition.

Innovation Solution

A fixture is provided with a frame, leveling plate, bracket, and laser profiler to determine the position of targets within the reaction chamber, using a laser profiler to project a line onto targets and acquire height measurements to ensure precise positioning and alignment of components such as shelves, one-piece rings, and susceptors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional positioning methods are used for structures in reaction chambers, then device complexity is reduced, but manufacturing precision and measurement precision deteriorate due to inability to accurately determine target positions

Engineering Contradiction:
Improvepositioning precision of structuresVSAvoidfixture structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical positioning methods with an optical measurement system. A laser profiler projects laser lines onto targets and measures their positions non-contactly, eliminating the need for complex mechanical positioning mechanisms while achieving high measurement precision (0.1 micrometer accuracy).

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces passive targets as intermediaries between the laser profiler and the structures being measured. These targets are positioned at known locations on structures (shelves, one-piece rings, susceptors) and serve as reference points for accurate position determination without requiring direct measurement of the structures themselves.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If manual positioning methods are used for substrates and components, then ease of operation is maintained, but productivity deteriorates due to time-consuming adjustments and repositioning

Engineering Contradiction:
Improvedeposition process efficiencyVSAvoidoperation simplicity
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The patent implements preliminary positioning of passive targets on all structures before deposition begins. The laser profiler measures target positions in advance, allowing the system to identify and correct positioning deviations before they affect the deposition process, eliminating time-consuming adjustments during production.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent establishes a feedback loop where the laser profiler continuously monitors target positions and provides data to the control system. This enables real-time detection of positioning deviations and automatic correction, maintaining high productivity while ensuring consistent component placement accuracy throughout the deposition process.

Inventive Principle:
Principle #23Feedback

3Measurement precision

If simple measurement methods are used, then device complexity is reduced, but measurement precision deteriorates due to inability to detect small position deviations

Engineering Contradiction:
Improvetarget position measurement accuracyVSAvoidmeasurement system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces simple mechanical measurement methods with laser-based optical measurement. The laser profiler uses laser line projection and non-contact height sensing to achieve 0.1 micrometer measurement precision, detecting even minor position deviations that would be impossible to measure with traditional mechanical tools.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from two-dimensional position measurement to three-dimensional measurement by adding height dimension detection. The laser profiler not only measures lateral positions but also vertical heights of targets and structures, providing comprehensive spatial information for precise positioning verification and correction.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures accurate determination of component positions, reducing variations in gas flow and thermal conditions, thereby improving the consistency and quality of film deposition on substrates.

Implementation Method 1

The laser profiler is suspended from the bracket, overlays the reaction chamber, and has a field of view extending through the leveling plate and the frame to determine position of a target within the reaction chamber

Methodology Applied
Scientific EffectLaser: Laser

Data Source

PatentUS12354893B2Fixture and method for determining position of a target in a reaction chamber
Publication Date: 2025.07.08 ASM IP HLDG BV
  • US12354893B2 patent drawing
  • US12354893B2 patent drawing
  • US12354893B2 patent drawing

AI summary

A fixture includes a frame, a leveling plate, a bracket, and a laser profiler. The frame is arranged for fixation above a reaction chamber arranged to deposit a film onto a substrate. The leveling plate is supported on the frame. The bracket is supported on the leveling plate. The laser profiler is suspended from the bracket, overlays the reaction chamber, and has a field of view that extends through the leveling plate and the frame to determine position of a target within the reaction chamber. Semiconductor processing systems and methods of determining position of targets within reaction chambers in semiconductor processing systems are also described.