Reactive Elastomer Resin Composition for Flexible, Low-Expansion Package Films
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Solution Overview
Problem
Existing resin compositions used in forming resin films for semiconductor packages face issues with flexibility and thermal expansion, leading to cracks and stress, while also generating volatile components during curing, which affect the reliability of printed wiring boards and semiconductor packages.
Innovation Solution
A resin composition comprising a thermosetting resin, a low molecular weight reactive liquid compound, an elastomer with a reactive group, and an inorganic filler, which improves flexibility and suppresses volatile component generation during curing, while maintaining low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermosetting resin is used to achieve high heat resistance, then heat resistance is improved, but flexibility deteriorates leading to cracks during handling
Solution Approach 1:
The patent uses a composite resin system combining thermosetting resin (for heat resistance) with elastomer particles (for flexibility). This composite approach allows the cured product to simultaneously achieve high heat resistance and improved flexibility, preventing cracks during handling while maintaining the required thermal performance.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the resin system by controlling the glass transition temperature (Tg) of the elastomer particles and optimizing their content (5-50 mass%). By adjusting these parameters, the cured product achieves both high heat resistance and sufficient flexibility to prevent cracking during handling.
2Reliability
If an inorganic filler is added to reduce thermal expansion, then low thermal expansivity is improved, but flexibility deteriorates causing cracks
Solution Approach 1:
The patent creates a composite system where inorganic filler particles are dispersed within a flexible resin matrix containing elastomer particles. This composite structure allows the inorganic filler to provide low thermal expansion while the elastomer-modified matrix maintains flexibility, preventing cracks even with high filler content (70-95 mass%).
Solution Approach 2:
The patent optimizes the particle size distribution and shape of inorganic filler particles, and controls their surface treatment, to improve dispersion and reduce stress concentration. Combined with controlling elastomer content and Tg, this allows achieving low thermal expansion (α ≤ 70 × 10^-7 /°C) while maintaining flexibility to prevent cracking.
3Strength
If a small amount of organic solvent is added to improve flexibility, then flexibility is improved, but volatile component generation increases during heating and curing
Solution Approach 1:
The patent extracts the flexibility-providing function from organic solvents and transfers it to elastomer particles. By using elastomer particles instead of organic solvents to provide flexibility, the system eliminates volatile component generation during heating and curing while maintaining the required flexibility to prevent cracks during handling.
Solution Approach 2:
The patent changes the state of the flexibility-providing component from liquid (organic solvent) to solid particles (elastomer). This parameter change eliminates volatility while maintaining flexibility, allowing the resin to achieve both crack resistance and low volatile organic compound (VOC) emissions during processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition forms a cured product with excellent flexibility and low thermal expansion, reducing crack formation and volatile component generation, enhancing the reliability of resin films, printed wiring boards, and semiconductor packages.
Implementation Method 1
containing elastomer particles having a glass transition temperature (Tg) of -50° C. to 0° C. The generated stress may cause a warpage of a semiconductor package, resulting in a decrease in reliability.
Implementation Method 2
a inorganic filler (D) The resin composition forms a cured product having excellent flexibility and low thermal expansion
Data Source
AI summary
The embodiment relates to a resin composition containing a thermosetting resin (A), a compound that is in a liquid state at 25° C., has a reactive group, and has a molecular weight of 1,000 or less (B), an elastomer having a reactive group and having a molecular weight of more than 1,000 (C), and an inorganic filler (D), as well as a resin film, a printed wiring board, and a semiconductor package, in each of which the resin composition is used.