Reactive Etchant Composition for IC Dry Etching
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Solution Overview
Problem
Dry etching processes in integrated circuit manufacturing face contamination issues due to the formation of non-volatile byproducts when certain etchant compositions react, leading to inefficiencies in gas delivery lines.
Innovation Solution
A reactive composition comprising a reactive etchant species, such as BCl3, combined with an oxygen-containing species like CO, is used to enhance etch selectivity and prevent deposition of non-volatile byproducts in gas delivery lines by forming oxygen radicals during plasma etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If certain etchant compositions are used for dry etching, then etching capability is achieved, but non-volatile byproduct compounds are formed that contaminate gas delivery lines
Solution Approach 1:
The patent changes the chemical composition parameters of the etchant by adding oxygen-containing species (O2, CO, CO2, H2O, or N2O) to the conventional etchant composition (BCl3, SiCl4, or CF4). This parameter modification alters the reaction products from non-volatile compounds to volatile oxides, resolving the contamination issue while preserving etching capability
Solution Approach 2:
The patent converts the potentially harmful non-volatile byproducts into beneficial volatile oxide species through oxidation reactions. The added oxygen-containing species oxidize the reaction products, transforming them into volatile compounds (BOx, SiOx, CFxOy) that can be easily removed, thus converting a harmful effect into a beneficial outcome
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains high etch selectivity while preventing contamination in the etching system, ensuring efficient and clean etching processes by controlling the molar ratio and flow rates of the reactive composition components.
Implementation Method 1
Dry etching, sometimes also referred to as plasma etching
Implementation Method 2
a reactive composition that includes a reactive etchant species and an oxygen-containing species
Data Source
AI summary
In the manufacture of integrated circuits, reactive compositions that include a reactive etchant species and an oxygen-containing species can provide selective removal of target material and can reduce contamination of gas delivery lines.