Reactive Organosilicon Thixotropic Agent for Transparent LED Encapsulation

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Solution Overview

Problem

Existing organosilicon encapsulation adhesives for LED elements face issues with unstable thixotropic properties, poor transparency, and inadequate mechanical and adhesion properties due to filler dispersion problems and compatibility issues with thixotropic agents.

Innovation Solution

A reactive organosilicon thixotropic agent is prepared through a hydrosilylation reaction of cyclic or branched hydrogen-containing polysiloxane with unsaturated polyether, ensuring a ratio of SiH bonds to olefinic bonds greater than 1, which enhances compatibility and stability, resulting in an organosilicon encapsulation adhesive with improved thixotropy, transparency, and mechanical and adhesion properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If fillers such as silicon dioxide, carbon black, organic bentonite are added to obtain thixotropy, then thixotropic property is improved, but uniform dispersion is difficult and settlement occurs easily, resulting in unstable thixotropic property and impaired transparency

Engineering Contradiction:
Improvethixotropic property stabilityVSAvoidtransparency
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent uses a reactive thixotropic agent as an intermediary substance that mediates between the filler particles and the organosilicon encapsulation adhesive matrix. This agent improves the dispersion of fillers and prevents settlement, thereby maintaining stable thixotropic properties while preserving transparency. The thixotropic agent acts as a bridge that enhances compatibility between incompatible components.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the chemical and physical parameters of the thixotropic agent by selecting specific reactive organosilicon compounds with controlled molecular weight, viscosity, and functional group content. By adjusting these parameters, the patent achieves optimal balance between thixotropic stability and transparency, resolving the contradiction between these two properties.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If conventional organosilicon thixotropic agents are used to improve thixotropic stability, then thixotropic stability is improved, but compatibility with organosilicon encapsulation adhesive matrix (especially containing phenyl) is poor, resulting in turbidity and difficult to obtain high transparency

Engineering Contradiction:
Improvethixotropic stabilityVSAvoidtransparency
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent achieves homogeneity between the thixotropic agent and the organosilicon encapsulation adhesive matrix by selecting thixotropic agents with similar chemical structure and functional groups. The reactive organosilicon thixotropic agent contains phenyl groups that match the matrix composition, ensuring homogeneous mixing and preventing phase separation that would cause turbidity, thereby maintaining high transparency while providing thixotropic stability.

Inventive Principle:
Principle #33Homogeneity

3Stability of the object's composition

If organosilicon thixotropic agent is added to improve thixotropic stability, then thixotropic stability is improved, but mechanical property and adhesion property are not improved and may be deteriorated

Engineering Contradiction:
Improvethixotropic stabilityVSAvoidmechanical property and adhesion property
Core Design Contradiction:
Stability of the object's compositionVSStrength

Solution Approach 1:

The reactive organosilicon thixotropic agent performs self-service by participating in the crosslinking reaction of the organosilicon encapsulation adhesive matrix. Instead of merely acting as a passive thickening agent, the thixotropic agent contributes its functional groups to form covalent bonds with the matrix, thereby enhancing mechanical strength and adhesion properties while maintaining thixotropic stability.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent creates a composite material system where the reactive thixotropic agent and the organosilicon encapsulation adhesive matrix are chemically bonded together through crosslinking reactions. This composite structure combines the thixotropic properties of the agent with the mechanical strength and adhesion of the matrix, achieving synergistic effects that improve all properties simultaneously rather than compromising any single property.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reactive organosilicon thixotropic agent provides stable thixotropic properties, high transparency, and excellent mechanical and adhesion properties to the encapsulation adhesive, leading to superior LED element encapsulation performance.

Implementation Method 1

A reactive organosilicon thixotropic agent is prepared through a hydrosilylation reaction of cyclic or branched hydrogen-containing polysiloxane with unsaturated polyether

Methodology Applied
Scientific EffectHydrosilylation reaction: Chemical Bonding

Data Source

PatentUS12426414B2Reactive organosilicon thixotropic agent, organosilicon encapsulation adhesive and LED element
Publication Date: 2025.09.23 BEIJING KMT TECH

AI summary

Disclosed is a reactive organosilicon thixotropic agent, an organosilicon encapsulation adhesive containing the reactive organosilicon thixotropic agent, and an LED element encapsulated by using the organosilicon encapsulation adhesive. In the present disclosure, the reactive organosilicon thixotropic agent is prepared by a hydrosilylation reaction of cyclic hydrogen-containing polysiloxane or branched hydrogen-containing polysiloxane that contains phenyl with unsaturated polyether under the condition that the ratio of the total quantity of SiH bonds in the cyclic hydrogen-containing polysiloxane or the branched hydrogen-containing polysiloxane to the total quantity of olefinic bonds in the unsaturated polyether is greater than 1, can provides the organosilicon encapsulation adhesive with stable thixotropic property, high transparency, and excellent mechanical property and adhesion property at the same time, and thus an LED element having great encapsulation property is manufactured.