Reactive Silicone Composition for Low-Loss Optical Wiring

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Optical materials for optoelectronic composite substrates require low propagation loss in the long wavelength region, heat resistance, adjustable refractive index, and high processability for precise optical wiring formation.

Innovation Solution

A reactive silicone composition comprising a specific reactive silicone compound and titanium oxide-containing colloidal particles with a modified organosilicon surface, allowing for adjustable refractive index and excellent light and heat resistance, and enabling easy formation through light irradiation or heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional optical adhesives are used, then transparency is achieved, but heat resistance is insufficient for lead-free soldering temperatures

Engineering Contradiction:

Improveheat resistanceVSAvoidoptical adhesive performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent uses a composite material system combining organometallic catalyst components with silicone-based adhesive matrices. This composite approach enables the adhesive to withstand lead-free soldering temperatures (280°C or higher) while maintaining optical transparency and bonding performance, resolving the contradiction between heat resistance and optical performance.

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If refractive index is adjusted to reduce optical loss, then optical transmission efficiency improves, but material selection becomes more constrained

Engineering Contradiction:

Improveoptical lossVSAvoidmaterial adjustability

Core Design Contradiction:

Loss of energyVSAdaptability or versatility

Solution Approach 1:

The patent employs parameter changes by systematically adjusting the refractive index of the optical adhesive through compositional modifications. The organometallic catalyst system enables precise control of curing characteristics, allowing optimization of refractive index matching between adhesive and optical waveguide to minimize optical loss while maintaining material versatility.

Inventive Principle:

Principle #35Parameter changes

3Strength

If high-strength lead-free solder is used, then element fixation is improved, but required processing temperature increases to 280°C

Engineering Contradiction:

Improveelement fixation strengthVSAvoidprocessing temperature

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent applies preliminary action by pre-formulating the optical adhesive with organometallic catalyst components that enable the adhesive to maintain its mechanical strength and optical properties after exposure to high temperatures (280°C or higher). This preliminary preparation ensures the adhesive can withstand the elevated processing temperatures required for lead-free soldering without degrading.

Inventive Principle:

Principle #10Preliminary action

4Manufacturing precision

If fine optical wiring structures are formed, then optical signal transmission precision improves, but manufacturing complexity increases

Engineering Contradiction:

Improveoptical wiring precisionVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical alignment and positioning processes with a chemical approach. The organometallic catalyst system enables precise optical wiring formation through controlled chemical reactions and self-assembly mechanisms, reducing manufacturing complexity while achieving fine structure precision required for optical signal transmission.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reactive silicone composition achieves high transparency, low propagation loss, and adjustable refractive index, enhancing the reliability of optical devices and allowing for precise optical wiring formation with improved light resistance and storage stability.

Implementation Method 1

enabling easy formation through light irradiation or heating

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

enabling easy formation through light irradiation or heating

Methodology Applied

Scientific EffectThermal curing: Heating

Data Source

PatentUS12129409B2Reactive silicone composition and cured product thereof

Publication Date: 2024.10.29 NISSAN CHEM CORP

AI summary

A reactive silicone composition including component (S) and component (T) below, the component (S): a reactive silicone compound including a condensation product of a diaryl silicate compound represented by Formula [1] and a silicon compound represented by Formula [2],(wherein Ar1 and Ar2 each independently represent a phenyl group optionally substituted by a C1-6 alkyl group and X represents a hydrolyzable reactive group), the component (T): modified titanium oxide-containing oxide colloidal particles produced by bonding an organosilicon compound to surfaces of titanium oxide-containing oxide colloidal particles (C) having an average particle diameter of from 2 to 100 nm and including, as a core, titanium oxide-containing metal oxide colloidal particles (A), surfaces of which are coated with a coating including silicon dioxide- and tin oxide-containing composite oxide colloidal particles (B).