Reactive Sputtering Inorganic Layer for Fluorine Resin Adhesion
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Solution Overview
Problem
Conventional film formation methods using fluorine-containing resins for touch panels experience reduced adhesion between the stain-proofing layer and the underlying layer over time, leading to potential damage and contamination.
Innovation Solution
A film formation method involving the reactive sputtering technique using water vapor to form an inorganic layer on a substrate, which enhances the adhesion of a fluorine-containing organic layer, with the inorganic layer comprising materials like Si, Al, Ta, Nb, Ti, Zr, Sn, Zn, Mg, and In, and optionally subjected to plasma treatment for improved adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If vacuum deposition technique is used to form fluorine-containing resin film, then film quality is improved, but adhesion between stain-proofing layer and underlying layer deteriorates over time
Solution Approach 1:
An inorganic layer is introduced as an intermediary between the substrate and the fluorine-containing resin stain-proofing layer. This intermediate layer, formed by reactive sputtering, provides a surface that enhances adhesion to the organic stain-proofing layer while allowing the vacuum deposition technique to maintain its film quality benefits.
Solution Approach 2:
The formation method of the intermediate layer is changed from conventional techniques to reactive sputtering with water vapor. This parameter change in the deposition process creates an inorganic layer with specific surface properties that improve adhesion to the fluorine-containing resin, resolving the adhesion deterioration problem over time.
2Device complexity
If conventional inorganic layer formation is used, then process simplicity is maintained, but adhesion to organic layer deteriorates
Solution Approach 1:
The inorganic layer formation process uses reactive sputtering with water vapor as the reactive gas, changing the deposition parameters to create an inorganic layer with enhanced surface properties. This parameter change improves adhesion to the organic stain-proofing layer while maintaining a relatively simple single-step process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high adhesion between the inorganic and organic layers, maintaining film quality and durability even with repeated use, effectively preventing damage and contamination.
Implementation Method 1
an inorganic layer is formed on the substrate to be processed according to the reactive sputtering technique, while using water vapor as a reactive gas
Implementation Method 2
water vapor is introduced into the inorganic layer-forming chamber through the water vapor-introducing means and an electric voltage is applied, through the electric voltage-application means, to thus form a plasma and to thereby form an inorganic layer
Data Source
AI summary
A film formation method is one for forming an organic layer comprising a fluorine-containing resin on an inorganic layer (3) formed on a substrate and comprising an inorganic substance. In the method, for the formation of the inorganic layer, a reactive sputtering procedure using water vapor as a reactive gas is carried out to form the inorganic layer on the substrate. Subsequently, the organic layer is formed on the inorganic layer. A film formation device enables the implementation of the film formation method.