Reactive Sputtering Apparatus Pressure Stabilization
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Solution Overview
Problem
Conventional reactive sputtering apparatuses face challenges in producing high-quality compound thin films with good reproducibility due to pressure stabilization issues and film adhesion problems, leading to yield degradation and impractical maintenance processes.
Innovation Solution
A reactive sputtering apparatus design featuring a chamber with a substrate holder, target holder, deposition shield plate, inert gas introduction ports, and a shielding member to prevent sputter particle adhesion, allowing for separate replacement of the deposition shield plate and gas introduction pipes, and stabilizing pressure through inert gas introduction outside the sputtering space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the deposition shield plate is periodically replaced for maintenance, then the film quality can be maintained, but the pressure in the sputtering space fluctuates due to mounting errors, leading to yield degradation
Solution Approach 1:
The gas introduction system is segmented into multiple independent ports: a first gas introduction port for introducing gas into the sputtering space, and a second gas introduction port for introducing gas into the space outside the sputtering space. This segmentation allows independent control and replacement of each port, eliminating the need to replace the entire integrated structure and reducing mounting errors that cause pressure fluctuations.
Solution Approach 2:
A shielding member is introduced as an intermediary component between the target and the gas introduction ports. This shielding member prevents sputter particles from adhering to the gas introduction ports, thereby preventing film adhesion and peeling issues while allowing the ports to be replaced independently without affecting overall system reliability.
2Device complexity
If the deposition shield plate and gas introduction port are integrally formed, then the structure is simplified, but it becomes impossible to replace only the deposition shield plate, requiring replacement of the entire assembly which generates mounting errors and consumes time
Solution Approach 1:
The previously integrated deposition shield plate and gas introduction port are divided into separate components. The gas introduction ports are now independent elements that can be replaced separately from the deposition shield plate, enabling selective maintenance and reducing the complexity of replacement procedures while improving ease of repair.
Solution Approach 2:
The gas introduction ports are designed as replaceable components that can be discarded when contaminated with adhered films and recovered or replaced independently. This allows the deposition shield plate to be retained and reused, reducing maintenance time and avoiding the mounting errors associated with replacing entire integrated assemblies.
3Productivity
If the deposition shield plate with adhered film is continuously used for a long period, then replacement frequency is reduced, but the film peels off and generates particles in the chamber, degrading yield
Solution Approach 1:
A shielding member is positioned as an intermediary between the target and the gas introduction ports to intercept sputter particles before they can adhere to the ports. This prevents film buildup on the gas introduction ports, eliminating the need for frequent replacements while preventing particle generation from peeling films, thus resolving the contradiction between productivity and particle contamination.
Solution Approach 2:
The shielding member converts the potentially harmful effect of sputter particles into a beneficial outcome by directing them away from the gas introduction ports. Instead of allowing particles to adhere to and contaminate the ports (which would require frequent replacement), the shielding member redirects them to safe areas, maintaining productivity while preventing contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances film quality and reproducibility by stabilizing pressure and reducing maintenance errors, improving yield and reducing the frequency of gas introduction pipe replacements.
Implementation Method 1
an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber
Implementation Method 2
a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space
Implementation Method 3
a reactive sputtering apparatus adds a reactive gas such as oxygen or nitrogen to a discharge gas such as argon gas used in a normal sputtering apparatus to generate a compound thin film by the reaction of the reactive gas and sputter particles sputtered from a target material
Implementation Method 4
a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber
Implementation Method 5
a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering
Data Source
AI summary
A reactive sputtering apparatus includes a chamber, a substrate holder provided in the chamber, a target holder which is provided in the chamber and configured to hold a target, a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber, a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space, an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber, and a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering.