Reactive Tape for Semiconductor Module Bonding
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Solution Overview
Problem
When developing new semiconductor modules, the difference in curing temperatures between new and previous potting materials can cause the potting material to prematurely cure and leak out, as it may start to cure before the adhesive glue, leading to manufacturing issues.
Innovation Solution
A method involving the use of a reactive tape applied to the surfaces of the substrate and housing, which cures simultaneously with the potting material, providing a durable bond without the need for additional adhesive materials and preventing leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a new potting material with lower curing temperature is used, then the curing process becomes more efficient and less energy-intensive, but the potting material starts to cure before the adhesive glue, causing leakage out of the housing
Solution Approach 1:
The patent combines the adhesive function and sealing function into a single reactive tape component. The reactive tape contains both adhesive material for bonding the housing to the substrate and sealing material for preventing potting material leakage. By merging these two functions into one component that cures simultaneously with the potting material, the patent eliminates the curing temperature mismatch problem while maintaining both bonding and sealing reliability.
Solution Approach 2:
The reactive tape is applied to the housing surface before the potting material is injected. The tape is positioned in advance to ensure proper sealing and bonding locations are prepared. This preliminary placement allows the sealing function to be ready before the potting material cures, preventing leakage from the outset.
2Productivity
If a reactive tape is applied to the housing surface, then sealing and bonding are achieved simultaneously, but the process complexity increases due to additional materials and steps
Solution Approach 1:
The reactive tape integrates adhesive and sealing functions into a single component, reducing the total number of separate materials needed. Instead of using separate adhesive materials and sealing materials, the reactive tape performs both functions simultaneously, simplifying the bill of materials while maintaining functional completeness.
Solution Approach 2:
The reactive tape is designed as a multi-functional component that simultaneously provides adhesive bonding between the housing and substrate, and sealing to prevent potting material leakage. This universal component replaces what would traditionally require multiple separate materials, reducing process complexity despite the advanced functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures a reliable and leak-proof bonding process by synchronizing the curing temperatures of the potting material and reactive tape, eliminating the need for separate adhesive materials and additional heating steps, thus enhancing the fabrication process.
Implementation Method 1
curing the potting material and the reactive tape
Data Source
AI summary
A method for fabricating a semiconductor device module includes: providing a substrate having one or more semiconductor dies disposed thereon; providing a housing; applying a reactive tape on partial surfaces of one or both of the substrate and the housing; mounting the housing onto the substrate; filling in a potting material into an interior of the housing; and curing the potting material and the reactive tape.