Reactivity-Introduced Compound for Adhesion Without Etching
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Solution Overview
Problem
Current methods for improving adhesion between materials in composite materials, such as in electronic devices and vehicle components, face limitations in achieving strong and durable bonds without surface irregularities or substrate deterioration, particularly in the absence of etching or discharge treatments.
Innovation Solution
A reactivity-introduced compound with a triazine ring, alkoxysilyl group, and diazomethyl group is used, which reacts with light to generate highly reactive species for bonding, enhancing adhesion by forming a stable silanol group and increasing the frequency of interfacial reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If etching treatment is performed to form fine irregularities on substrate surface, then adhesion is improved, but transmission loss and heat generation increase due to longer signal transmission distance
Solution Approach 1:
The patent introduces a coupling agent as an intermediary substance that chemically bonds to both the substrate surface and the metal film. This mediator provides adhesion enhancement through chemical bonding rather than physical anchoring, eliminating the need for etching-induced irregularities that cause transmission loss.
Solution Approach 2:
The patent replaces the mechanical anchoring mechanism (anchor effect from physical irregularities) with a chemical bonding mechanism. The coupling agent forms chemical bonds that provide adhesion without requiring surface irregularities, thus substituting a mechanical system with a chemical one.
2Strength
If corona discharge treatment is applied to introduce OH groups, then adhesion is improved, but substrate deterioration occurs and OH group introduction is limited
Solution Approach 1:
The coupling agent serves as a safe intermediary that introduces reactive functional groups to the substrate surface without the harsh conditions of corona discharge. This mediator achieves OH group introduction or direct bonding without causing substrate deterioration.
Solution Approach 2:
The patent changes the method parameters from high-energy plasma treatment (corona discharge) to温和的化学处理 using coupling agents. This parameter change allows functional group introduction at lower energy levels that do not deteriorate the substrate.
3Strength
If conventional coupling agents are used to improve adhesion, then bonding strength is enhanced, but reactivity and bonding efficiency are insufficient
Solution Approach 1:
The patent employs a composite coupling agent containing multiple functional groups (silane groups for inorganic material bonding, and organic functional groups like amino or mercapto groups for organic material bonding). This composite structure enables simultaneous or sequential bonding to both types of materials with high reactivity.
Solution Approach 2:
The coupling agent exhibits local quality by having different functional groups at different locations within the molecule. One end contains groups reactive with inorganic materials (silane), while the other end contains groups reactive with organic materials (amino, mercapto), enabling targeted bonding at different interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in higher adhesion strength and improved bonding efficiency, reducing the likelihood of peeling and enhancing the durability of metal plating on resin surfaces, while being more effective than existing compounds with azide groups.
Implementation Method 1
reacts with light to generate highly reactive species for bonding
Implementation Method 2
hydrolyze to form a silanol
Implementation Method 3
bind by condensation with a similar functional group on glass and the like or with an OH group on a metal oxide
Data Source
AI summary
There are provided a reactivity-introduced compound that imparts reactivity capable of bonding of a solid to another material, can perform imparting to a solid with high efficiency, and has high adhesion of bonding, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.There are provided a reactivity-introduced compound provided on a surface of the solid for bonding the solid to another material, the reactivity-introduced compound including a triazine ring, an alkoxysilyl group (including a case where an alkoxy group in the alkoxysilyl group is OH), and a diazomethyl group in one molecule, a manufacturing method thereof, a surface-reactive solid using the same, and a manufacturing method of a surface-reactive solid.


