Real-Time Defective Mounting Detection in Component Mounting Devices
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Solution Overview
Problem
Existing electronic component mounting devices cannot immediately detect defective mounting on a substrate until all components are mounted, leading to inefficiencies and potential losses.
Innovation Solution
A component mounting device with a mounting head, imaging section, and controller that compares images before and after component mounting to determine the mounting state in real-time, allowing for immediate detection of defective mounting during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If all electronic components are mounted on the substrate before mounting determination, then the mounting determination can be made based on a complete image, but defective mounting cannot be detected until all components are mounted, leading to delayed detection and potential losses
Solution Approach 1:
The imaging section captures images at intermediate stages during the mounting process (before all components are mounted), enabling preliminary mounting determination to be made early in the process. This allows defective mounting to be detected immediately when it occurs, rather than waiting until the end of the entire mounting process.
2Reliability
If mounting determination is made after all components are mounted, then the complete mounting state can be assessed, but the time required for mounting increases due to inability to stop early upon detecting defects
Solution Approach 1:
The system implements real-time feedback by continuously capturing images during the mounting process and immediately analyzing them to determine mounting state. When defective mounting is detected, the system provides feedback to stop the mounting process, preventing further waste of time and resources.
3Ease of manufacture
If imaging is performed separately from the mounting head movement, then the imaging operation can be completed independently, but additional time is required for separate imaging operations
Solution Approach 1:
The imaging section is integrated with the mounting head, combining the imaging function with the mounting operation. Images are captured during the mounting head's downward and upward movements, merging the imaging operation with the existing mounting cycle and eliminating separate imaging time.
Data Source
AI summary
A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.