Through-Hole Reamer Surface Layout to Prevent Chip Scoring

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Solution Overview

Problem

Reamers often cause scratches and scoring in through-holes due to chip passage between the reamer's circumferential surface and the perforated wall, leading to reduced surface quality and potential jamming.

Innovation Solution

A reamer design featuring relief-ground regions on its circular cylindrical lateral surface, separated from chip chambers by lateral surface portions, which prevent chips from entering the relief-ground areas, combined with coolant supply channels to manage friction and chip disposal, ensuring high surface quality and preventing jamming.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If relief-ground regions are provided on the reamer surface, then surface quality of the reamed hole is improved, but chips may pass between the reamer and perforated wall causing scratches and scoring

Engineering Contradiction:
Improvesurface qualityVSAvoidscratches and scoring
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The reamer surface is segmented into distinct functional zones: relief-ground regions for quality machining, chip chambers for chip collection, and lateral surface portions acting as barriers. This segmentation prevents chips from migrating from chip chambers to relief-ground regions, eliminating scratches and scoring while maintaining high surface quality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Lateral surface portions serve as intermediary barrier elements between chip chambers and relief-ground regions. These lateral surface portions contact the perforated wall and prevent direct chip passage, acting as a protective mediator that maintains the integrity of the relief-ground regions.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If chip chambers are provided for chip collection, then chip management is improved, but chips may escape into relief-ground regions causing surface defects

Engineering Contradiction:
Improvechip managementVSAvoidsurface quality
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The reamer is divided into functionally separated zones with lateral surface portions creating physical barriers between chip chambers and relief-ground regions. This segmentation allows effective chip collection while preventing chip escape, resolving the contradiction between chip management ease and surface quality.

Inventive Principle:
Principle #1Segmentation

3Stability of the object's composition

If the circumferential surface of the reamer contacts the perforated wall, then machining stability is improved, but chips can pass between the reamer and workpiece

Engineering Contradiction:
Improvemachining stabilityVSAvoidchip passage
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

Different regions of the reamer circumferential surface have different contact functions: relief-ground regions provide stable contact for quality machining, while lateral surface portions provide localized contact specifically for chip containment. This local differentiation allows stability maintenance while preventing chip passage.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240082933A1Reamer for machining of through-holes
Publication Date: 2024.03.14 KENNAMETAL INC
  • US20240082933A1 patent drawing

AI summary

The invention relates to a reamer for machining through-holes, having a base body comprising a clamping region as well as a front-facing machining region with cutting elements, wherein the machining region comprises front-facing chip chambers and regions that are relief-ground on a circular cylindrical lateral surface defining the maximum radial dimension of the reamer in the machining region, which relief-ground regions are spaced apart from the perforated wall in a circular cylindrical through-hole, wherein the chip chambers and adjacent relief-ground regions are separated from one another by lateral surface portions.