Rear-Bonded Display Wiring With Vertical Vias for Narrow Bezel Panels
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Solution Overview
Problem
Conventional display devices have a significant peripheral area (bezel) that hinders the reduction of the display area, and existing manufacturing methods can cause reliability issues and damage to light-emitting elements during the formation of via holes.
Innovation Solution
A display device with a rear-bonding structure featuring a base substrate with a vertical conductive member formed in a trench before pixel formation, allowing for a minimized bezel and preventing damage by avoiding laser-drilling and panel inversion, with an under-panel driver electrically connected to the vertical conductive member for efficient signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional wiring structure is used in the peripheral area, then signal transfer is achieved, but the peripheral area (bezel) becomes large
Solution Approach 1:
The patent moves the driver circuit from the peripheral area to the display area by transitioning to a rear-bonding structure. The under-panel driver is positioned beneath the display panel and connects to pixels through vertical conductive members, effectively utilizing the vertical dimension to relocate components and minimize the peripheral bezel area while maintaining signal transfer functionality.
2Reliability
If via holes are formed through laser-drilling after pixel formation, then electrical connection is achieved, but light-emitting elements may be damaged
Solution Approach 1:
The vertical conductive members are formed in trenches within the substrate before the pixel structure and light-emitting elements are created. This preliminary formation of conductive paths eliminates the need for subsequent laser-drilling operations that could damage delicate light-emitting elements, thereby improving reliability while maintaining manufacturing feasibility.
3Reliability
If the panel is inverted for via hole filling, then electrical connection is achieved, but defects may occur during inversion
Solution Approach 1:
The vertical conductive members are formed in trenches within the substrate before the pixel structure and light-emitting elements are created. This preliminary formation of conductive paths eliminates the need for subsequent laser-drilling operations that could damage delicate light-emitting elements, thereby improving reliability while maintaining manufacturing feasibility.
4Reliability
If vertical conductive members are formed in trenches before pixel formation, then step-related reliability issues are prevented, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is segmented into regions with trenches formed to accommodate vertical conductive members. By dividing the substrate structure and forming trenches at specific locations, the patent enables precise placement of conductive members before pixel formation, preventing step-related reliability issues while managing manufacturing precision through structured segmentation.
Data Source
AI summary
A display device includes a base substrate including a rigid material, a plurality of pixels disposed on a display area of the base substrate, a vertical conductive member disposed through the display area of the base substrate, a first transfer wiring electrically contacting the vertical conductive member and extending in a horizontal direction, and an under-panel driver disposed under the base substrate and electrically connected to the vertical conductive member.