Rear-Side Display Circuit Layout With Through-Substrate Connections
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Solution Overview
Problem
Existing display devices face challenges in optimizing the layout of driving circuit components, leading to inefficiencies in space utilization and potential dead spaces on the substrate.
Innovation Solution
The display device incorporates a driving circuit unit positioned on the rear surface of a base substrate, utilizing a substrate connection electrode and etching stopper to facilitate electrical connections, along with a buffer layer and light blocking layers to enhance structural integrity and reduce dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the driving circuit unit is disposed on the front surface of the base substrate, then the electrical connection is simplified, but the dead space increases and manufacturing complexity increases due to etching solution diffusion risks
Solution Approach 1:
The driving circuit unit is moved from the front surface (2D plane) to the rear surface of the base substrate, utilizing the third dimension (thickness direction) to resolve the conflict between electrical connection simplicity and dead space reduction. This spatial reconfiguration allows the circuit unit to be positioned below the display area without increasing dead space.
Solution Approach 2:
The substrate connection electrode is inserted into a through-hole that passes through the base substrate, creating a nested structure where the electrode is contained within the substrate thickness. This nesting approach simplifies the electrical connection path while avoiding the need for complex lateral routing that would increase dead space.
2Ease of manufacture
If high aspect ratio substrate through-holes are used, then the manufacturing process is simplified, but etching solution diffusion may occur causing corrosion
Solution Approach 1:
A buffer layer is introduced as an intermediary material filling the space between the substrate connection electrode and the etching stopper in the through-hole. This buffer layer acts as a barrier that prevents etching solution from reaching and corroding the electrode, while still allowing the through-hole to maintain a high aspect ratio for manufacturing simplicity.
Solution Approach 2:
The etching stopper is positioned at the front surface opening of the through-hole to prevent etching solution diffusion in advance. By placing this protective structure before the etching process, the patent preemptively blocks the harmful etching solution from penetrating deeper into the through-hole and corroding the substrate connection electrode.
3Object-affected harmful factors
If the etching stopper covers the substrate through-hole opening, then etching solution diffusion is prevented, but component protection complexity increases
Solution Approach 1:
The etching stopper is designed to serve multiple functions simultaneously: it prevents etching solution diffusion into the through-hole, provides structural support at the front surface, and defines the opening boundary for the through-hole. By combining these functions into a single component, the patent avoids increasing overall device complexity while effectively preventing etching solution corrosion.
Data Source
AI summary
A display device comprises a base substrate which is a base substrate having a display area and a non-display area positioned around the display area defined therein, and includes a substrate connection electrode penetrating the base substrate in the thickness direction, an etching stopper which is disposed on a first surface of the base substrate and that covers the substrate connection electrode, and a first pad disposed on a second surface opposite to the first surface of the base substrate and disposed overlapping a substrate through hole, wherein the substrate connection electrode is disposed in the display area, the substrate connection electrode is electrically connected to the etching stopper and the first pad, the etching stopper is electrically connected to the first pad through the substrate connection electrode, and the etching stopper includes a conductive material.