Rear-Mounted Drive Chip for High Screen-to-Body Ratio
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Solution Overview
Problem
Conventional electronic devices face a challenge in achieving a high screen-to-body ratio due to the space occupied by the driver chip on the display module, which reduces the effective display area.
Innovation Solution
The display module incorporates a flexible circuit board with a drive chip located below the display screen, utilizing a curved electrical connection section to maintain electrical connectivity while minimizing space usage, allowing for a higher screen-to-body ratio by positioning the drive chip on the opposite side of the display module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the driver chip is placed on the same side as the display area to facilitate electrical connection, then the electrical connection is simplified, but the screen-to-body ratio decreases due to occupied front display area
Solution Approach 1:
The driver chip is moved from the front side (2D plane of display) to the rear side of the display module, utilizing the third dimension (depth/thickness) to resolve the spatial conflict. This allows the chip to be electrically connected to the display screen through conductive structures extending from the rear side, thereby maintaining electrical connectivity while eliminating occupation of the front display area and maximizing screen-to-body ratio.
Solution Approach 2:
Conductive structures (such as conductive adhesives or flexible printed circuit boards) are introduced as intermediary elements to establish electrical connection between the driver chip on the rear side and the display screen on the front side. These intermediaries bridge the spatial gap created by moving the chip to the rear, enabling electrical functionality without requiring the chip to be positioned on the front display area.
2Area of moving object
If the driver chip is moved to the rear side to maximize display area, then the screen-to-body ratio increases, but the electrical connection structure becomes more complex
Solution Approach 1:
The driver chip is integrated with the rear side of the display module, and the conductive structures are merged with existing structural elements such as the flexible printed circuit board or conductive adhesive layers already present in the display assembly. This merging approach minimizes additional complexity by utilizing existing pathways and structures rather than introducing entirely new connection mechanisms.
3Ease of manufacture
If the driver chip is placed on the front side for easier assembly, then the assembly process is simplified, but the usable display area is reduced
Solution Approach 1:
The assembly process is adapted to place the driver chip on the rear side of the display module during the manufacturing process. This dimensional relocation allows standard assembly techniques to be applied without requiring front-side chip placement, thereby maintaining manufacturing simplicity while maximizing the usable front display area.
Data Source
AI summary
The present disclosure relates to a display module and a mobile terminal. The display module includes a flexible circuit board, a display screen electrically connected to the flexible circuit board, and a drive chip electrically connected to the flexible circuit board and the display screen. The drive chip is located on a first side of the display module that is opposite to a second side of the display module that constitutes a display side of the display screen.