Rear-Mounted Drivers for Seamless Tiled Display Substrates
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Solution Overview
Problem
In display, illumination, and light receiver units, the need to provide space for drivers and connection terminals on the top surface of mounting substrates results in visible seams when multiple substrates are tiled, affecting the aesthetic quality of the displayed or emitted images.
Innovation Solution
The drivers are integrated within the pixel region of the mounting substrate, with each pixel row or multiple pixel rows assigned to a driver, eliminating the need for top surface mounting and connection terminals, allowing seamless tiling of substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If drivers are mounted on the top surface end of the mounting substrate (COG or COF technique), then the driver can be properly connected and controlled, but a frame region must be provided where display pixels cannot be disposed, causing visible seams when multiple substrates are tiled
Solution Approach 1:
The patent relocates the drivers from the top surface (2D plane) to the rear surface of the mounting substrate, utilizing the third dimension (depth/thickness) to resolve the contradiction. This allows the top surface to be fully utilized for pixel arrangement without frame regions, eliminating visible seams while maintaining proper driver connection through rear-surface mounting and FPC extension.
2Reliability
If a frame region is provided on the mounting substrate to accommodate drivers and connection terminals, then proper connection and control are achieved, but the display area is reduced and seams become visible when substrates are tiled
Solution Approach 1:
The patent moves the driver mounting location from the top surface to the rear surface of the substrate, utilizing the depth dimension to eliminate the need for frame regions. This increases the display area to the full top surface while maintaining connection reliability through the extended FPC structure that reaches from the rear surface to the front edge.
Solution Approach 2:
The patent introduces an extended FPC as an intermediary element that bridges the rear-surface driver location with the front edge connection point. This mediator allows reliable driver connection without requiring top-surface frame regions, thus maximizing display area while ensuring proper electrical connections.
3Area of stationary object
If multiple mounting substrates are tiled to expand display area, then larger display coverage is achieved, but visible seams appear at the boundaries between substrates
Solution Approach 1:
By relocating drivers to the rear surface, the patent eliminates top-surface frame regions that would create visible seams. This allows substrates to be tiled edge-to-edge with full pixel coverage, achieving seamless image continuity across multiple substrates while expanding total display coverage.
Data Source
AI summary
There is provided a mounting substrate that makes a seam more inconspicuous when a plurality of mounting substrates are tiled, and an electronic apparatus including the mounting substrate.The mounting substrate includes a wiring substrate, a plurality of pixels (11) arranged in a matrix in a pixel region of the wiring substrate, and a plurality of drivers (14A) that are disposed in the pixel region and select the pixels in units of two or more pixels. Each of the pixels includes an optical element that emits or receives light, and a pixel circuit that controls light emission or light reception of the optical element. One or more of the plurality of drivers are assigned to each pixel row or every plurality of pixel rows.