Rear Surface Infrared Sensor Through Hole Design
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Solution Overview
Problem
The existing infrared sensors of the rear surface irradiation type have a narrow field of view due to the restricted size of the through hole, which is influenced by the peripheral circuit, making it difficult to miniaturize the sensor without affecting circuit characteristics or reducing the substrate thickness.
Innovation Solution
The infrared sensor features a through hole configuration with a combination of first and second through hole constituent parts having different shapes, allowing for increased angle of field without altering the substrate thickness, achieved through specific etching methods and mask formations during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the through hole size is increased to widen the field of view, then the angle of field is improved, but the peripheral circuit characteristics are affected and substrate thickness must be reduced
Solution Approach 1:
The through hole is divided into two separate constituent parts: a first through hole constituent part extending from the upper surface to a first depth, and a second through hole constituent part extending from the lower surface to a second depth. These two parts are positioned offset from each other, creating a segmented structure that allows each part to be optimized independently for different functions - one for field of view and the other for circuit protection.
Solution Approach 2:
The invention transitions from a single-dimensional through hole (single opening size) to a two-dimensional configuration by introducing offset positioning between the first and second through hole constituent parts. This dimensional change allows the field of view to be determined by the combined geometry of both parts while maintaining separate optimization paths for circuit characteristics.
2Area of moving object
If the through hole size is increased to widen the field of view, then the angle of field is improved, but the substrate thickness is reduced
Solution Approach 1:
The through hole is divided into two separate constituent parts: a first through hole constituent part extending from the upper surface to a first depth, and a second through hole constituent part extending from the lower surface to a second depth. These two parts are positioned offset from each other, creating a segmented structure that allows each part to be optimized independently for different functions - one for field of view and the other for circuit protection.
Solution Approach 2:
The first and second through hole constituent parts are nested within the substrate thickness, with each part extending only partially through the substrate. This nesting approach allows the combined geometry of both parts to define a larger field of view while each individual part maintains a depth that preserves overall substrate thickness.
3Area of moving object
If the substrate thickness is reduced to accommodate larger through hole, then the angle of field is improved, but the mechanical strength and heat insulation are compromised
Solution Approach 1:
The through hole is divided into two separate constituent parts: a first through hole constituent part extending from the upper surface to a first depth, and a second through hole constituent part extending from the lower surface to a second depth. These two parts are positioned offset from each other, creating a segmented structure that allows each part to be optimized independently for different functions - one for field of view and the other for circuit protection.
Solution Approach 2:
The invention transitions from a single-dimensional through hole (single opening size) to a two-dimensional configuration by introducing offset positioning between the first and second through hole constituent parts. This dimensional change allows the field of view to be determined by the combined geometry of both parts while maintaining separate optimization paths for circuit characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the angle of field of the infrared sensor, enabling wider viewing capabilities while maintaining circuit characteristics and substrate thickness, facilitating further miniaturization without compromising performance.
Implementation Method 1
an infrared absorption part 3 and a temperature sensor part 4 are formed on a substrate 1. The infrared absorption part 3 is a thin film made of a material that absorbs infrared rays.
Implementation Method 2
The temperature sensor part 4 is provided for the purpose of obtaining a change in the temperature occurring as a result of the infrared absorption part 3 absorbing infrared rays. In FIGS. 1A and 1B, an example of employing the temperature sensor part 4 of a thermopile type is shown.
Data Source
AI summary
A rear-surface-irradiation-type infrared sensor includes a substrate having a through hole passing through between an upper surface and a lower surface; an infrared absorption part on the substrate on a side of the upper surface separate from the substrate by the through hole; and a temperature sensor part detecting a change in a temperature of the infrared absorption part. The through hole includes a first through hole part having an opening on the upper surface and one or more second through hole parts having shapes different from the first through hole constituent part. The first through hole part and the second through hole part(s) communicate with each other. In a cross-sectional shape of the through hole on a plane perpendicular to the upper surface, an inside wall of the first through hole part is outside an inside wall of the of second through hole part(s).