Rear-Wired Light-Emitting Module for High-Output Heat Dissipation
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Solution Overview
Problem
Conventional light-emitting devices face challenges in efficiently releasing heat from high-output light sources used in three-dimensional image acquisition, which is crucial for secure authentication methods like face recognition, as they often rely on substrates with low thermal conductivity.
Innovation Solution
A light-emitting device design featuring a heat releasing base member with thermal conductivity of 10 W/m·K or more, where the light source is positioned on the front surface and wires connected to the electrodes are strategically placed on both the front and rear surfaces to facilitate efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional substrate with low thermal conductivity is used, then the device structure is simple, but heat dissipation efficiency deteriorates
Solution Approach 1:
The base member is divided into a front surface and a rear surface with distinct functional zones. The rear surface is specifically designed with wire arrangements that create heat dissipation pathways, separating the light emission function (front surface) from the heat dissipation function (rear surface).
Solution Approach 2:
The base member serves multiple functions: it provides mechanical support for the light-emitting element, acts as a thermal management component through its wire configuration, and facilitates heat transfer to external components. The wires serve both electrical connection and heat dissipation purposes.
2Temperature
If only two wires are provided on the rear surface for electrode connections, then the wiring is simple, but heat dissipation capability is insufficient
Solution Approach 1:
The additional reference potential wire serves dual purposes: it provides a third electrical connection point for circuit functionality and creates an extended heat dissipation pathway. This wire configuration allows the electrical wiring structure to simultaneously fulfill both electrical and thermal management functions.
Solution Approach 2:
The wire arrangement extends beyond the traditional two-wire configuration by adding a reference potential wire, creating a three-dimensional wiring structure that provides multiple heat dissipation pathways. This dimensional expansion of the wiring structure enables enhanced thermal management without significantly increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat release from the light source, improving the reliability and efficiency of three-dimensional image acquisition systems by reducing thermal resistance and enhancing the performance of high-output light sources.
Implementation Method 1
a heat releasing base member having thermal conductivity of 10 W/m·K or more... allows for effective heat release from the light source, improving the reliability and efficiency... by reducing thermal resistance
Data Source
AI summary
A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element provided on a front surface side of the base member; a first rear surface wire that is provided on a rear surface side of the base member and is connected to one of a cathode electrode and an anode electrode of the light-emitting element; a second rear surface wire that is provided on the rear surface side of the base member and is connected to the other one of the cathode electrode and the anode electrode; and a reference potential wire that is provided on the rear surface side of the base member and is connected to an external reference potential.