Implantable Receiver With Integrated Coil And Reduced Layer Inner Area
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Solution Overview
Problem
Existing implantable receivers for energy transmission are bulky and require numerous assembly steps, making them prone to errors and costly to produce due to the use of multiple printed circuit boards and manual pin connections.
Innovation Solution
A compact implantable receiver design featuring a multi-layer circuit board with an integral coil, where the number of layers is reduced in the inner area to create cavities for electronic components, allowing for a more robust and cost-effective assembly process, and incorporating a flexible area for higher inductance and current load capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple printed circuit boards are used with manual pin connections, then the receiver can be assembled with standard components, but the assembly process becomes complex and error-prone
Solution Approach 1:
The patent combines multiple separate printed circuit boards into a single integrated circuit board structure. The coil is directly integrated into the circuit board layers, eliminating the need for separate board assemblies and manual pin connections. This merging reduces the number of assembly steps and minimizes potential connection errors while maintaining manufacturability.
Solution Approach 2:
The patent implements a nested structure where the coil is embedded within the multi-layer circuit board. The coil windings are formed using conductive layers that are nested between insulating layers, creating a compact integrated structure. This nesting approach eliminates the need for separate coil assemblies and reduces overall device complexity.
2Volume of moving object
If the coil is integrated into the circuit board, then the receiver becomes more compact, but the manufacturing process becomes more complex
Solution Approach 1:
The patent uses standard multi-layer circuit board manufacturing parameters and processes to create the integrated coil structure. By utilizing conventional PCB layering techniques with conductive and insulating materials, the manufacturing process remains compatible with existing production capabilities while achieving a compact integrated design.
Solution Approach 2:
The patent employs composite material structures typical of multi-layer circuit boards, combining conductive layers (for the coil) with insulating layers (for isolation and support). This composite approach allows the coil to be integrated into the circuit board using standard materials and manufacturing processes, avoiding the need for specialized production techniques.
3Reliability
If layers are removed from the inner area to create cavities, then electronic components are protected, but the manufacturing process requires additional steps
Solution Approach 1:
The patent incorporates cavity formation as an integral part of the multi-layer circuit board manufacturing process. The cavities are created during the layer building process by selectively omitting material in the inner area, rather than requiring post-assembly modifications. This preliminary action protects electronic components during the manufacturing process itself and eliminates additional protective assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a more compact, efficient, and robust receiver with reduced assembly steps and lower production costs, while providing enhanced functionality and protection for electronic components, suitable for powering active implants.
Implementation Method 1
a coil for receiving energy or signals
Data Source
AI summary
Receiver (1), in particular an implantable receiver (1) for transmitting energy to an implant, with a multi-layer circuit board comprising a plurality of electrically conductive layers (11-16), wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, a coil which is integrally incorporated at least partially in the layers (11-16) of the circuit board in the coil area, wherein the number of the layers (11-16) of the circuit board is smaller within this inner area than in the coil area.