Receptacle Assembly Layout for Internal PCB Wiring Around Connector Openings
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Solution Overview
Problem
Existing receptacle assemblies and circuit boards face challenges in routing internal layer wirings efficiently, particularly when forming holes for connectors, which can interfere with wiring patterns and require additional space for openings.
Innovation Solution
The proposed receptacle assembly and circuit board design include a connector with specific pin group arrangements and electrode lines, allowing internal layer wirings to be drawn between these lines, reducing the need for wirings in outer regions and ensuring space for openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If holes (openings) are formed in the circuit board for connector installation, then the connector can be mounted and electrical connections can be established, but the routing of internal layer wirings becomes more difficult and requires additional space
Solution Approach 1:
The patent utilizes the third direction (depth/thickness dimension of the circuit board) to route internal layer wirings between the first and second electrode lines, transforming a two-dimensional wiring problem into a three-dimensional solution. This allows wirings to pass through the internal layers without interfering with the outer region openings, effectively resolving the conflict between connector mounting and wiring routing.
2Reliability
If internal layer wirings are routed to outer regions to connect electrodes, then electrical connections can be established, but the area available for openings and other components is reduced
Solution Approach 1:
The patent routes internal layer wirings in the third direction (through internal layers) rather than in the plane of the outer region, creating a vertical separation between wiring paths and opening locations. This dimensional separation allows both wirings and openings to coexist without competing for the same planar space.
Solution Approach 2:
The patent segments the wiring paths into different spatial zones: external wirings in the outer region and internal layer wirings in the internal region between electrode lines. This segmentation allows independent optimization of each zone, with openings placed in the outer region and wirings routed through internal layers, eliminating spatial conflict.
3Adaptability or versatility
If multiple electrode lines are arranged in the third direction to accommodate multiple pin groups, then more contact pins can be connected, but the routing of internal layer wirings becomes more complex
Solution Approach 1:
The patent arranges electrode lines and pin groups along the third direction (depth dimension) and routes internal layer wirings between these lines in the same third direction. This vertical stacking approach allows multiple pin groups to be connected while maintaining organized, non-interfering wiring paths through the internal layers, preventing complexity from increasing proportionally with the number of pin groups.
Data Source
AI summary
Provided are a receptacle assembly and a circuit board in which routing of internal layer wirings is taken into consideration. Some of the plurality of first internal layer wirings 134 are drawn toward the second electrode line L2 when viewed in the depth direction Dd, and some of the plurality of second internal layer wirings 134 are drawn toward the first electrode line L1 when viewed in the depth direction Dd.