Receptacle Assembly Layout for PCB Internal Wiring Routing
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Solution Overview
Problem
Existing receptacle assemblies and circuit boards face challenges in efficiently routing internal layer wirings, particularly when forming holes for connectors, which can interfere with wiring patterns and reduce available space for openings.
Innovation Solution
The proposed receptacle assembly and circuit board design include a connector with specific pin group arrangements and electrode lines, allowing internal layer wirings to be drawn between electrode lines, reducing the need for wirings in outer regions and ensuring space for openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If holes are formed in the circuit board for connector mounting, then the connector can be fixed to the circuit board, but the routing of internal layer wirings becomes complicated and space for openings is reduced
Solution Approach 1:
The patent utilizes the third direction (depth/thickness direction of the circuit board) by forming holes that penetrate from the first face to the second face. This dimensional approach allows contact pins to pass through the board, establishing electrical connections without requiring complex surface wiring routes, thus resolving the contradiction between reliable connector fixation and wiring routing complexity
2Reliability
If holes are formed in the circuit board for connector mounting, then the connector can be fixed to the circuit board, but the area available for openings is reduced
Solution Approach 1:
The patent segments the electrical connection function into multiple contact pins arranged in pin groups, where each pin group is mounted on a separate electrode line. This segmentation allows wirings to be distributed across different regions of the circuit board, reducing the concentration of wiring routes in any single area and preserving more space for openings
3Reliability
If internal layer wirings are drawn to outer regions, then connections can be established, but the space for openings is insufficient
Solution Approach 1:
The patent transitions from two-dimensional surface wiring to three-dimensional routing by drawing internal layer wirings toward each other in the depth direction (third direction) through the circuit board thickness. This allows wirings to cross between layers without occupying additional surface area, maintaining opening space while establishing reliable electrical connections
Data Source
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AI summary
Provided are a receptacle assembly and a circuit board in which routing of internal layer wirings is taken into consideration. Some of the plurality of first internal layer wirings 134 are drawn toward the second electrode line L2 when viewed in the depth direction Dd, and some of the plurality of second internal layer wirings 134 are drawn toward the first electrode line L1 when viewed in the depth direction Dd.