Recess Plating Using Dissolvable Gas to Eliminate Air Barriers
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Solution Overview
Problem
Conventional methods for plating or filling recesses in substrates are complex and costly due to the need for sub-atmospheric pressure or vacuum to remove ambient air, which creates a gaseous barrier that disrupts continuous coating or filling, leading to reduced reliability and lifespan of devices.
Innovation Solution
A method and device that use a replacement gas to clear ambient gas from recesses, allowing the gas to dissolve in a processing fluid, thereby eliminating the gaseous barrier and enabling continuous plating or filling at atmospheric pressure without the need for expensive vacuum equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sub-atmospheric pressure or vacuum is used to remove ambient air from recesses, then the gaseous barrier is eliminated and continuous plating is achieved, but the device complexity and cost increase due to expensive vacuum equipment and complex pressure control systems
Solution Approach 1:
The patent extracts the harmful ambient air from recesses by introducing a replacement gas that displaces and removes the ambient gas through dissolution in processing fluid, eliminating the need for vacuum systems while achieving continuous plating quality
Solution Approach 2:
The patent introduces a replacement gas as an intermediary substance that mediates between the ambient air and the processing fluid. This replacement gas dissolves in the processing fluid, creating a gas-free environment in recesses without requiring vacuum equipment
2Reliability
If sub-atmospheric pressure or vacuum is used to remove ambient air from recesses, then the gaseous barrier is eliminated and continuous plating is achieved, but the manufacturing cost increases due to expensive vacuum equipment and time-intensive procedures
Solution Approach 1:
The patent extracts the harmful ambient air from recesses by introducing a replacement gas that displaces and removes the ambient gas through dissolution in processing fluid, eliminating the need for vacuum systems while achieving continuous plating quality
Solution Approach 2:
The patent uses a disposable replacement gas that is introduced, performs its function of displacing ambient air, and then dissolves in the processing fluid, replacing expensive vacuum equipment with a low-cost consumable gas
3Productivity
If ambient air is present in recesses, then the handling process is simple and fast, but the plating process is interrupted and device reliability is reduced
Solution Approach 1:
The patent performs preliminary action by introducing the replacement gas and processing fluid to dissolve the replacement gas before the plating process begins, ensuring that recesses are completely free of gaseous barriers that would interrupt plating
Solution Approach 2:
The patent ensures continuous plating by eliminating gaseous barriers in recesses through the replacement gas dissolution process, allowing the plating to proceed without interruption from ambient air pockets
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and cost-reduces the plating process, ensuring continuous and complete filling of recesses, resulting in devices with superior electrical and mechanical properties and extended lifespan.
Implementation Method 1
applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas
Data Source
AI summary
The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:Providing a substrate with a substrate surface comprising at least one recess,applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas,applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, andplating the recess.