Image Sensor Package Structure With Recessed Circuit Board Nesting
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Solution Overview
Problem
Existing semiconductor packages face challenges in miniaturization and integration of image sensors due to structural limitations, which hinder the development of compact and multifunctional electronic devices.
Innovation Solution
A semiconductor package design featuring a circuit board with a recessed region and a transparent substrate of greater horizontal width, where an image sensor chip is mounted, utilizing a connection terminal and gap-fill member for electrical connection and protection, and incorporating a transparent substrate with optional IR cut filters to enhance light transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the circuit board structure is simplified for easier manufacturing, then manufacturing precision deteriorates
Solution Approach 1:
The circuit board is divided into a first portion and a second portion with different horizontal extensions, creating a recessed region. This segmentation allows the board to be manufactured using standard processes while achieving the complex three-dimensional mounting structure needed for precise component placement and electrical connection.
Solution Approach 2:
The circuit board transitions from a simple two-dimensional plane to a three-dimensional structure with varying horizontal extensions at different vertical levels. The first portion extends further horizontally than the second portion, creating a recessed region that enables precise positioning of the image sensor chip and connection terminals without requiring complex manufacturing processes.
2Volume of moving object
If the package size is reduced for miniaturization, then manufacturing precision deteriorates
Solution Approach 1:
The image sensor chip is mounted within the recessed region formed by the first and second portions of the circuit board. This nested arrangement allows the chip to be precisely positioned and secured in a compact space, maintaining manufacturing precision while minimizing the overall package volume.
Solution Approach 2:
By creating vertical differentiation in the circuit board's horizontal extension (first portion vs. second portion), the design utilizes the third dimension to achieve precise component positioning. This enables compact packaging without sacrificing manufacturing precision, as the recessed region provides a defined mounting space for the image sensor chip.
3Illumination intensity
If the transparent substrate width is increased for better light transfer, then device complexity increases
Solution Approach 1:
The transparent substrate is designed with a width greater than the circuit board only in the regions where light transfer is needed (above the image sensor chip and active array region). This localized extension provides optimal light transfer efficiency without unnecessarily increasing the overall device complexity or size in other areas.
Solution Approach 2:
The transparent substrate serves multiple functions: it provides structural support, enables light transfer to the image sensor chip, and defines the optical path through its width. By optimizing its width to be greater than the circuit board, it simultaneously achieves structural integrity and optimal optical performance without requiring additional separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for reduced package size and improved light transfer efficiency, minimizing thermal damage during manufacturing and enabling the integration of advanced image sensor functionalities in smaller form factors.
Implementation Method 1
A transparent substrate is disposed on the circuit board. An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate.
Implementation Method 2
An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate.
Data Source
AI summary
A semiconductor package that includes a circuit board having an opening therein. The circuit board includes a first portion, and a second portion disposed below the first portion. The first portion protrudes further in a horizontal direction towards the opening than the second portion. A transparent substrate is disposed on the circuit board. An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate. A connection terminal directly contacts a lower surface of the first portion of the circuit board and an upper surface of the image sensor chip. A gap-fill member covers the connection terminal and covers a portion of an upper surface of the image sensor chip and at least a portion of a lateral side surface of the image sensor chip. The transparent substrate has a greater horizontal width than the circuit board.