Electronic Module Recessed Bump Connections for Compact Packaging
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Solution Overview
Problem
Existing modules with electronic components mounted on substrates have a high profile and large size when viewed from above, as some mounting electrodes are connected to regions outside recesses, making them bulky.
Innovation Solution
All bumps connecting the electronic component to the substrate are located within recesses on the substrate surface, with the component extending outside the recess perimeter, and the bumps' height exceeding the recess depth, allowing for a lower profile and reduced overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If some mounting electrodes are connected to regions outside recesses, then the electronic component can be properly connected, but the module becomes higher in profile and larger in size
Solution Approach 1:
The invention transitions the connection structure from a planar arrangement (electrodes on the same surface level) to a three-dimensional arrangement (electrodes extending into recesses). By positioning mounting electrodes within recesses formed in the substrate, the connection path utilizes the vertical dimension, allowing the module to achieve lower profile height while maintaining reliable electrical connections through the bump structures that extend into the recesses.
2Reliability
If mounting electrodes are connected outside recesses, then connection is achieved, but the overall size when viewed from above increases
Solution Approach 1:
The invention implements nesting by placing the mounting electrodes inside the recesses of the substrate. The bump structures are positioned within the recess volume, and the electronic component is mounted such that its connection electrodes engage with the bumps inside the recess. This nested arrangement allows the connection function to be achieved within the substrate's own structure, reducing the need for additional external connection areas and thereby minimizing the module's footprint.
3Area of stationary object
If all bumps are connected inside recesses with height greater than recess depth, then module size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The invention applies preliminary action by pre-forming the recesses in the substrate before mounting the electronic component. The recesses are created with predetermined dimensions, depths, and positions that match the required bump configurations. This preliminary preparation of the substrate structure provides a predefined guide and constraint system that facilitates accurate bump placement during subsequent manufacturing steps, thereby managing precision requirements through advance structural preparation.
Data Source
AI summary
A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.