Recessed Chip Package Structure for Spacer-Free Hybrid Assembly

Solution Overview

Problem

The manufacturing process of hybrid packages is time-consuming and costly due to the need for multiple process stations and spacers, which increases the likelihood of production problems and reduces efficiency.

Innovation Solution

A package structure and manufacturing method that includes a chip with a recess and a control element positioned between the base and the chip, with an underfill in the recess, simplifying the process, improving stability, and enhancing heat dissipation by creating a gap between the control element and the sidewall and filling the underfill to prevent gas entrapment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If spacers are used to support electronic elements, then structural stability is improved, but the number of process stations increases leading to more time consumption and higher material cost

Engineering Contradiction:

Improvestructural stabilityVSAvoidtime consumption

Core Design Contradiction:

Stability of the object's compositionVSLoss of time

Solution Approach 1:

The invention extracts and eliminates the spacer component from the package structure. By removing the spacer, the patent directly reduces the number of process stations needed for spacer attachment, thereby decreasing time consumption and material cost while maintaining structural stability through alternative design features.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the support function previously performed by separate spacers into the base structure itself. The base is designed with integrated support features that directly hold the electronic elements, combining multiple functions into a single component and eliminating the need for additional spacers and their associated process steps.

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If spacers are used to support electronic elements, then structural stability is improved, but the number of process stations increases leading to higher material cost

Engineering Contradiction:

Improvestructural stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The invention extracts and eliminates the spacer component from the package structure. By removing the spacer, the patent directly reduces the number of process stations needed for spacer attachment, thereby decreasing time consumption and material cost while maintaining structural stability through alternative design features.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the support function previously performed by separate spacers into the base structure itself. The base is designed with integrated support features that directly hold the electronic elements, combining multiple functions into a single component and eliminating the need for additional spacers and their associated process steps.

Inventive Principle:

Principle #5Merging (Combining)

3Stability of the object's composition

If multiple process stations are used, then structural stability is improved, but the probability of production problems increases

Engineering Contradiction:

Improvestructural stabilityVSAvoidproduction reliability

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The invention extracts and eliminates the spacer component from the package structure. By removing the spacer, the patent directly reduces the number of process stations needed for spacer attachment, thereby decreasing time consumption and material cost while maintaining structural stability through alternative design features.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the support function previously performed by separate spacers into the base structure itself. The base is designed with integrated support features that directly hold the electronic elements, combining multiple functions into a single component and eliminating the need for additional spacers and their associated process steps.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11848318B2Package structure and manufacturing method thereof

Publication Date: 2023.12.19 POWERTECH TECHNOLOGY INC

AI summary

A package structure and a manufacturing thereof are provided. The package structure includes a base, a chip, a control element and an underfill. The chip is disposed on the base and includes a recess, and the recess has a bottom surface and a sidewall. The control element is disposed between the base and the chip and disposed on the bottom surface of the recess, and a gap exists between the control element and the sidewall of the recess. The underfill is disposed in the recess. The chip and the control element are electrically connected to the base respectively.