Recessed Circuit Patterns for Thin, High-Throughput PCBs
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Solution Overview
Problem
The challenge of achieving lighter, thinner, and smaller printed circuit boards with improved signal throughput and matching in complex semiconductor packages, particularly in RF frequency bands, has not been adequately addressed in existing technologies.
Innovation Solution
A printed circuit board design featuring a first insulating layer with a circuit pattern protruding from its surface and recesses, covered by a metal portion that is spaced apart from the insulating layer, utilizing a metal material different from the circuit pattern to enhance electrical conductivity and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the printed circuit board is made lighter, thinner, and smaller, then weight reduction and miniaturization are achieved, but signal throughput and signal matching deteriorate
Solution Approach 1:
The patent applies local quality by using a dual-metal structure where different metal materials are used in different regions: a first metal material for the circuit pattern and a second metal material (with higher electrical conductivity) for the metal portion surrounding the circuit pattern. This localized differentiation allows the board to be thinner overall while maintaining high signal throughput in critical areas through the highly conductive second metal material.
2Weight of moving object
If the printed circuit board is made lighter, thinner, and smaller, then weight reduction and miniaturization are achieved, but electrical conductivity and signal transmission speed deteriorate
Solution Approach 1:
The patent employs composite materials by combining two different metal materials with distinct properties. The first metal material forms the circuit pattern while the second metal material (having higher electrical conductivity than the first) forms the surrounding metal portion. This composite structure enables the board to achieve reduced weight and thickness while maintaining superior electrical conductivity through the strategic use of the highly conductive second metal material in key signal transmission areas.
Data Source
AI summary
A printed circuit board includes: a first insulating layer; a circuit pattern protruding from an upper surface of the first insulating layer and having recesses in side surfaces thereof; and a metal portion covering an upper surface and each of both side surfaces of the circuit pattern. The first insulating layer is spaced apart from at least a portion of a lower surface of the circuit pattern.