Recessed Conductive Patterns for Display Driver Connections

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Solution Overview

Problem

Existing display devices face challenges in increasing the contact area between conductive layers and signal lines, leading to increased exposure of conductive layers outside the display panel, which can result in damage from external moisture and affect electrical connectivity.

Innovation Solution

The implementation of recessed conductive patterns on the display panel's side surfaces, where the conductive layers are buried within recessed portions and connected to drivers via anisotropic conductive films, minimizing external exposure and enhancing electrical connections by increasing contact areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the contact area between conductive layers and signal lines is increased, then electrical connection performance is improved, but external exposure of conductive layers increases leading to moisture damage

Engineering Contradiction:
Improveelectrical connection performanceVSAvoidmoisture exposure
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conductive layer is nested within a recessed portion of the substrate, creating a protected cavity that reduces external exposure while maintaining contact area. The anisotropic conductive film is then placed over the recessed area, sealing the conductive layer within a protected structure that allows electrical connection without direct external exposure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The solution transitions from a planar configuration to a three-dimensional structure by creating a recessed portion in the substrate. This vertical dimensionality change allows the conductive layer to be positioned below the substrate surface while maintaining adequate contact area, thereby reducing external exposure to moisture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the contact area between conductive layers and signal lines is increased, then electrical connection performance is improved, but the complexity of the manufacturing process increases

Engineering Contradiction:
Improveelectrical connection performanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The recessed portion is formed in the substrate before the conductive layer is applied. This preliminary action simplifies the subsequent manufacturing steps by providing a pre-prepared structure that naturally increases contact area without requiring additional complex processing steps during conductive layer formation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the electrical connection performance between conductive layers and signal lines while minimizing external exposure, thereby protecting the conductive layers from moisture and improving the overall reliability of the display device.

Implementation Method 1

connected to drivers via anisotropic conductive films

Methodology Applied
Scientific EffectAnisotropic conduction: Anisotropy

Data Source

PatentUS11614663B2Display device and manufacturing method thereof
Publication Date: 2023.03.28 SAMSUNG DISPLAY CO LTD
  • US11614663B2 patent drawing
  • US11614663B2 patent drawing
  • US11614663B2 patent drawing

AI summary

A display device includes a first substrate, a second substrate facing the first substrate, and a sealing layer respectively including first, second and third side surfaces coplanar with each other; a first recess defined recessed from each of the first side surface, the second side surface and the third side surface; a first conductive pattern in the first recess; and a first driver facing each of the first side surface, the second side surface and the third side surface. At the first recess: the first conductive pattern is exposed to outside the first substrate, the second substrate and the sealing layer, and the first driver is electrically connected to the first conductive pattern.