Recessed Contact Pads for Low-Profile PCB Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in integrated circuit device package substrates is to achieve both a reduced footprint and vertical profile height, while ensuring effective interconnections for components, particularly in the context of miniaturization and embedding components in printed wiring boards.
Innovation Solution
The implementation of recessed interconnections, specifically recessed contact pads with Z, L, or T shapes, embedded within the printed wiring board, allows for lower profile components and shared footprint deployments. These recessed contact pads are formed within a recess in the build-up lamination assembly, with electrical coupling structures connecting them to components embedded in the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are mounted on the surface of printed wiring boards, then electrical connections are established, but the vertical profile height increases and footprint area is consumed
Solution Approach 1:
The component is nested within a recess formed in the build-up lamination assembly, allowing the component to be embedded below the top surface of the printed wiring board. This nesting approach reduces the vertical profile height while maintaining electrical connections through contact pads that extend into the recess and connect to the component leads.
2Shape
If recessed contact pads are formed in the printed wiring board, then lower profile components are enabled, but manufacturing complexity increases
Solution Approach 1:
The recess is formed in the build-up lamination assembly during the manufacturing process before the component is installed. This preliminary action of creating the recess allows for subsequent easy embedding of low-profile components and simplifies the overall assembly process, as the recess preparation is integrated into the board fabrication sequence.
3Area of stationary object
If components are embedded in the printed wiring board, then footprint area is reduced, but electrical connection reliability may be compromised
Solution Approach 1:
The contact pads are specifically designed with local quality features including being formed of conductive material (such as copper) and extending into the recess to make direct contact with the component leads. This localized conductive structure ensures reliable electrical connections while maintaining the embedded configuration that reduces footprint area.
Data Source
AI summary
A printed wiring board is disclosed, with a build-up lamination material comprising a die side and a land side; a recess in the build-up lamination material at the die side, the recess comprising a recess floor; a first wall orthogonal to the recess floor; a second wall orthogonal to the recess floor, the second wall spaced apart from and opposite the first wall; a first recessed contact pad including a first vertical portion substantially in the recess at the first wall; a second recessed contact pad including a second vertical portion substantially in the recess at the second wall; and electrical coupling structures within the build-up lamination material, the electrical coupling structures coupled to each of the first recessed contact pad and the second recessed contact pad.