Recessed Cooling Plate Assembly for Space-Efficient Liquid Cooling
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Solution Overview
Problem
Current water-cooling devices in electronic devices face inefficiencies due to the space requirements of copper tubes, which complicate the installation of additional components and hinder optimal space utilization.
Innovation Solution
A cooling device with a heat dissipation plate assembly that forms a heat dissipation channel through a recessed structure, minimizing space usage and allowing for intricate heat dissipation pathways without compromising cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper tubes are used to form heat dissipation channels, then cooling efficiency is maintained, but space utilization deteriorates due to bending requirements and intricate tube layouts
Solution Approach 1:
The patent merges the heat dissipation channel structure with the support plate, integrating two previously separate components into one. The support plate itself is designed with through-holes that serve as heat dissipation channels, eliminating the need for separate copper tubes and their associated bending space, thus resolving the contradiction between maintaining cooling efficiency and improving space utilization
Solution Approach 2:
The patent extracts the heat dissipation function from the traditional copper tube system and embeds it directly into the support plate structure. By creating through-holes in the support plate that serve as heat dissipation channels, the design removes the need for external tubing while preserving the cooling function, thereby improving space utilization without sacrificing cooling performance
2Area of stationary object
If copper tubes with intricate layouts are used, then heat dissipation coverage is improved, but device complexity increases due to bent portions and installation complications
Solution Approach 1:
The patent combines the support plate and heat dissipation channel into a single integrated component. The through-holes in the support plate directly form the heat dissipation pathways, eliminating the need for separate tubing systems with bends and connections, thus reducing device complexity while maintaining heat dissipation coverage
Solution Approach 2:
Instead of using tubes to create heat dissipation channels, the patent inverts the approach by creating channels through holes in the support plate itself. This reversal of the traditional design methodology simplifies the overall structure by eliminating the need for tube bending and intricate routing, thereby reducing device complexity while preserving cooling coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances space utilization within electronic devices while maintaining cooling efficiency by optimizing the internal layout of heat dissipation channels.
Implementation Method 1
The first plate and the second plate together form a heat dissipation channel used to contain the cooling liquid... the cooling liquid to circulate within the heat dissipation channel
Data Source
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AI summary
A cooling device containing a cooling liquid includes a heat dissipation plate assembly and a pump. The heat dissipation plate assembly comprises a first plate and a second plate. The first plate features a recessed structure for thermally coupling with a heat source. The second plate covers the recessed structure to form a heat dissipation channel including an inlet and an outlet, among others. The heat dissipation channel accommodates the cooling liquid. The pump is in communication with both the inlet and outlet and serves to circulate the cooling liquid through the channel.