Semiconductor Package Recessed Dummy Terminals Against ESD Contact
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Solution Overview
Problem
Conventional semiconductor devices with dummy terminals protruding near the mold resin end face are prone to hand contact, leading to static electricity application and potential device failure.
Innovation Solution
A semiconductor device design featuring recessed portions and reduced protrusion of dummy terminals, ensuring a sufficient distance between hands and dummy terminals during handling, thereby preventing static electricity application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If dummy terminals are disposed to protrude near the end face of the mold resin to prevent lead frame deformation, then the dummy terminals can effectively prevent lead frames from becoming deformed during die-bonding, but the dummy terminals become accessible to hands during manual mounting, leading to static electricity application and potential device failure
Solution Approach 1:
The dummy terminal is repositioned from protruding at the end face of the mold resin to protruding from a recessed portion on the side surface of the package. This dimensional relocation moves the terminal from a readily accessible position to a protected recessed position, preventing hand contact during manual mounting while maintaining the lead frame deformation prevention function
2Ease of operation
If dummy terminals protrude from the end face of the mold resin, then they are easily accessible for connection, but they become vulnerable to hand contact and static electricity during manual handling
Solution Approach 1:
The dummy terminal is relocated from the end face to the side surface recessed portion, changing its spatial dimension. This relocation maintains operational accessibility while protecting against harmful static electricity exposure during manual handling
Solution Approach 2:
The recessed portion acts as an intermediary protective structure between the dummy terminal and the external environment. It allows the terminal to protrude for connection purposes while shielding it from direct hand contact and static electricity exposure
Data Source
AI summary
A semiconductor device includes: semiconductor elements; a package sealing the semiconductor elements and being rectangular in a top view; control terminals protruding from a first side of the package; output terminals protruding from a second side facing the first side of the package; and a recessed portion formed in a third side adjacent to the first side and the second side of the package, wherein a part of the control terminals is disposed at end portions of lead frames, the semiconductor device further includes dummy terminals disposed at other end portions of the lead frames, respectively, the dummy terminals protruding from the recessed portion, and an amount of the protrusion of each of the dummy terminals from the recessed portion is smaller than or equal to 0.75 mm.