Recessed Electrode Pads on Substrate for Mounting Boards
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Solution Overview
Problem
Existing electronic device mounting boards face issues with electrode pad damage and defective mounting due to their placement on fixtures or tools, leading to reduced bonding strength and increased likelihood of substrate cracking or breaking during electronic component bonding.
Innovation Solution
The electronic device mounting board features a substrate with a first recess on one surface and a second recess on the opposite surface, where the electrode pads are located within the first recess, separate from the second recess in a plan view, reducing contact with fixtures and distributing pressure to minimize damage and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrode pads are placed on the front or back surface of the substrate, then mounting of electronic components is enabled, but the electrode pads may be damaged and cause defective mounting
Solution Approach 1:
The electrode pads are moved from the surface plane to a recessed dimension, creating a stepped structure where the pads sit below the substrate surface. This dimensional change allows the pads to be protected from direct contact with mounting fixtures while still enabling electrical connection, thus resolving the contradiction between mounting capability and pad integrity.
Solution Approach 2:
The recess structure acts as a protective cushion for the electrode pads before mounting occurs. By pre-positioning the pads in a protected, recessed location, the design anticipates and prevents potential damage from fixture contact during the mounting process, thereby maintaining both manufacturability and reliability.
2Reliability
If electrode pads are placed on the substrate surface, then electrical connection is achieved, but substrate cracking or breaking may occur during bonding
Solution Approach 1:
By relocating the electrode pads to a recessed dimension rather than the surface plane, the design distributes bonding stresses away from the substrate's critical structural areas. The recess acts as a stress-absorbing feature that prevents crack propagation, thereby maintaining both electrical connection reliability and substrate strength.
3Ease of operation
If electrode pads contact fixtures during mounting, then mounting process is simplified, but bonding strength is reduced
Solution Approach 1:
The recessed positioning of electrode pads creates a controlled interface between the pad and mounting fixture. This dimensional arrangement allows fixtures to contact the substrate surface around the recess rather than directly on the pads themselves, simplifying the mounting process while preserving bonding strength through proper stress distribution.
Data Source
AI summary
A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.