Recessed Electrode Plating Layout for Low-Profile Electronic Components
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Solution Overview
Problem
Existing electronic components with applied plating films result in protrusions that create extra space around mounted electrodes, reducing the available design volume due to increased thickness and profile, which is undesirable in modern, compact products.
Innovation Solution
The electronic component features a base electrode disposed within a recess on its surface, with the plating film flush or protruding no more than the reference plane, ensuring the electrode is fully accommodated and eliminating extra space, thereby maximizing design volume. This configuration involves forming a recessed area for the electrode and plating film to prevent protrusions and enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating film is applied to the base electrode surface, then the electrode can be soldered and mounted, but the electrode protrudes from the dielectric body surface creating extra space around it
Solution Approach 1:
The base electrode is disposed at a position more recessed than the reference plane before plating is applied. This preliminary positioning ensures that after plating, the plating film surface becomes flush with or does not protrude beyond the reference plane, eliminating extra space around the mounted electrode while maintaining soldering capability.
2Volume of moving object
If the electrode is made flush with the dielectric body surface, then no extra space is created, but the plating film cannot be properly applied
Solution Approach 1:
The base electrode is pre-positioned at a recessed location before plating. This allows the plating film to be applied to the exposed base electrode surface without creating protrusions, as the recessed positioning provides the necessary space for plating while ensuring the final plated surface remains flush with the reference plane.
3Volume of moving object
If the electrode is disposed close to the outer periphery of the recess, then space is maximized, but bonding strength decreases due to gaps
Solution Approach 1:
The base electrode is disposed at a specific position within the recess that balances space utilization and bonding strength. The electrode is positioned more recessed than the reference plane but not at the extreme periphery, creating an optimal local configuration that maintains adequate bonding area while maximizing the available design volume around the electrode.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces extra space around mounted electrodes, increasing the available design volume within the component and preventing gaps that could decrease bonding strength, while also minimizing the risk of cracks during manufacturing processes.
Implementation Method 1
a plating film covering the base electrode
Data Source
AI summary
An electronic component includes a body having a first surface, a base electrode disposed on the first surface, and a plating film covering the base electrode. The first surface has a reference plane and a recess more recessed than the reference plane. The base electrode is disposed inside the recess so as not to more protrude than the reference plane. A surface of the plating film that is farthest from the body is flush with the reference plane or is located at a position more protruding than the reference plane. When viewed from a direction perpendicular to the first surface, the base electrode is disposed inside the recess and spaced apart from an outer periphery of the recess.