Recessed Electronic Module in Surface Covering
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Solution Overview
Problem
Integration of electronic components into surface covering structures, such as floor coverings, faces challenges including inadequate protection against mechanical loads, disruption of the surface structure, and unsuitability for mass production, particularly in maintaining optical and thermal integrity.
Innovation Solution
A surface covering structure with a recessed electronic module encapsulated by a second layer, using materials like textiles or foam, which provides mechanical protection and a planar support surface, and a method involving a roll-to-roll process for mass production, ensuring the module is securely embedded and electrically connected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are integrated into surface covering structures, then additional functions and information are provided to users, but the electronic components are not sufficiently protected against mechanical stresses
Solution Approach 1:
The electronic component is nested within a recess in the first layer and covered by a second layer, creating a protective enclosure that shields the component from mechanical stresses while maintaining its functional integration in the surface covering structure
Solution Approach 2:
A adhesive material is introduced as an intermediary substance between the electronic component and the first layer, providing mechanical bonding and protection against stresses while allowing the component to maintain its electrical and functional properties
2Adaptability or versatility
If electronic components are integrated into surface covering structures, then functional capabilities are enhanced, but the surface structure is interrupted or broken through, impairing external appearance
Solution Approach 1:
The electronic component is nested within a recess that is filled by the second layer, creating a flush surface that maintains the integrity and continuity of the surface covering structure's external appearance while housing the functional component
Solution Approach 2:
The first layer is locally modified with a recess only in the specific area where the electronic component is to be integrated, while the rest of the surface maintains its original continuous structure and appearance
3Ease of manufacture
If conventional methods are used to integrate electronic modules into surface covering structures, then integration is achieved, but the methods are not suitable for mass production
Solution Approach 1:
The manufacturing process is segmented into distinct steps: providing the first layer with recess, placing the electronic module, applying the second layer, and removing excess material. This segmentation enables each step to be optimized and executed efficiently in a roll-to-roll manufacturing process
Solution Approach 2:
The recess is provided in the first layer before the electronic module is integrated, and the second layer is applied to cover the module. These preliminary actions prepare the structure for efficient mass production by pre-defining integration zones and simplifying the assembly process
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3~4
AI summary
The invention relates to a surface-covering structure (0) which comprises a first layer (1, 21), a recess (2, 22) in the first layer (1) and at least one electronic module (4, 8) in the recess (2, 22).