Recessed EMI Shielding Cover Assembly to Block Adhesive Wicking
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Solution Overview
Problem
Existing electronic circuits face issues with electromagnetic shielding due to adhesive material wicking and insecure attachment, which can interfere with the functioning of electronic components and affect mechanical stability.
Innovation Solution
A dual-layer electromagnetic shielding system comprising a metallic first cover and a polymer second cover, assembled with brazing joints and adhesive, providing comprehensive coverage and improved mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive material is used to attach the electromagnetic shielding cover to the substrate, then the attachment process is simple, but the adhesive may wick into the casing by capillary action and interfere with the proper functioning of the electronic component
Solution Approach 1:
The recessed part acts as an intermediary structure between the adhesive and the electronic component. It provides a dedicated attachment zone that physically separates the adhesive from the electronic component, allowing the adhesive to be applied without risking wicking into the casing while still achieving secure attachment of the electromagnetic shielding cover
Solution Approach 2:
The recessed part creates a localized attachment zone with specific geometric properties (recessed configuration) that differ from the surrounding areas. This local structural modification allows adhesive to be contained in a specific region away from the electronic component, enabling simple adhesive application while preventing harmful wicking
2Ease of manufacture
If adhesive material is used to attach the electromagnetic shielding cover to the substrate, then the attachment process is simple, but the attachment security is insufficient
Solution Approach 1:
The solution combines adhesive material with a structurally optimized recessed part configuration. The composite system of adhesive plus recessed geometry provides both the simplicity of adhesive application and enhanced attachment security through the mechanical interlocking provided by the recessed structure
Solution Approach 2:
The recessed part serves as a structural intermediary that enhances the adhesive bond. It provides increased surface area and mechanical interlocking features that strengthen the attachment while maintaining the simplicity of using adhesive material
3Object-affected harmful factors
If a metal cover is placed over the lid for electromagnetic shielding, then electromagnetic shielding is provided, but adhesive material may wick into the casing and interfere with electronic component operation
Solution Approach 1:
The recessed part creates a localized protective zone specifically positioned to prevent adhesive wicking toward the electronic component while allowing the metal cover to provide comprehensive electromagnetic shielding over the entire lid area
Solution Approach 2:
The recessed part acts as a protective intermediary structure that sits between the adhesive application area and the electronic component, allowing the metal electromagnetic shielding cover to be securely attached without risking adhesive interference with component operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures effective electromagnetic shielding and enhanced mechanical stability, preventing adhesive interference and ensuring reliable operation of electronic components.
Implementation Method 1
the first cover and the substrate being assembled to each other by means of a brazing joint
Implementation Method 2
the adhesive material, placed between the partition and the receiving chip, will wick into the casing by capillary action
Data Source
Figure 1~4
Figure 5~7
AI summary
This description relates to an electromagnetic shielding cover (100) for an electronic circuit comprising a main face (101) and four side faces (102, 103, 104, 105), a recessed portion (110) being formed at the base of a first side face (102). This description also relates to an electronic circuit, in particular an optical transmitting and/or receiving device, comprising a chip (350) fixed to a first main face (301) of a substrate (300), such an electromagnetic shielding cover (100) and a second cover (200) made of polymer material, the first cover (100) and the substrate (300) being joined to each other by means of a solder joint (400) soldered both to a metal pad (310) of the substrate (300) and to at least one of the walls of the recessed portion (110). The second hood (200) can be positioned on or under the first hood (100).