Recessed Gutter Wiring for Semiconductor Reliability
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Solution Overview
Problem
Conventional wire bonding methods for semiconductor devices face issues such as wire breakage during resin sealing due to high external forces, high costs due to the use of expensive gold wires, and low wiring density, as well as damage to insulating base materials from filler exposure and microcracks during CMP processes.
Innovation Solution
A method involving laser beam machining to form a wiring gutter on the surface of a semiconductor chip and insulating base material, followed by electroless plating to create a wiring conductor embedded within the gutter, which enhances adhesive strength and prevents filler exposure, thereby improving reliability and reducing the risk of wire damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding method is used to connect semiconductor chip to electrode pad, then electrical connection is achieved, but wire breakage occurs during resin sealing due to high external forces
Solution Approach 1:
The patent introduces a recessed gutter structure as an intermediary element between the wire and the resin sealing material. This gutter acts as a buffer zone that absorbs and distributes the external forces during resin filling, preventing direct transmission of stress to the wire. The wire is positioned within this protective recessed structure, which shields it from the high external forces generated during resin sealing, thereby preventing wire breakage while maintaining electrical connection reliability.
2Strength
If wire diameter is increased to prevent breakage, then wire strength is improved, but manufacturing cost increases due to use of expensive gold
Solution Approach 1:
The recessed gutter serves as a protective intermediary structure that enables the use of thinner, less expensive wires by providing mechanical protection against resin sealing forces. Instead of relying on increased wire diameter (which would require more gold), the gutter structure provides the necessary strength and protection, allowing optimization of wire dimensions to reduce gold consumption while maintaining reliability.
3Quantity of substance
If wire spacing is reduced to increase wiring density, then wiring density is improved, but wire damage risk increases due to insufficient sweep clearance
Solution Approach 1:
The recessed gutter acts as a protective intermediary that allows wires to be positioned closer together by providing a shielded environment. The gutter walls protect the wires from external forces during resin sealing, enabling reduced wire spacing without compromising reliability. This increases wiring density while maintaining wire integrity through the protective buffering effect of the gutter structure.
4Manufacturing precision
If CMP process is used to flatten surface, then surface flatness is improved, but filler exposure and microcracks occur in insulating base material
Solution Approach 1:
The patent applies preliminary protective coating to the insulating base material surface before the CMP process. This protective layer is applied in advance to prevent the mechanical and chemical actions of CMP from exposing fillers and creating microcracks. The preliminary protection allows the CMP process to achieve surface flatness without the harmful side effects of filler exposure and structural damage.
5Reliability
If seal material contains large amounts of inorganic filling material to provide insulation, then insulation performance is improved, but fluidity deteriorates requiring extremely high molding pressure
Solution Approach 1:
The recessed gutter structure acts as an intermediary that decouples the insulation requirement from the molding pressure requirement. By providing a dedicated recessed space for the seal material within the gutter, the high-viscosity material can be contained and cured in situ without requiring extreme pressure for flow and filling. This allows the use of high-inorganic-content seal materials for insulation while avoiding the need for extremely high molding pressures, as the gutter confines the material and reduces the pressure needed for proper sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents wire breakage and improves adhesive strength, allowing for higher precision and reliability in semiconductor devices with increased wiring density without exposing fillers, thus enhancing the structural integrity and performance of the semiconductor device.
Implementation Method 1
laser beam machining to form a wiring gutter
Implementation Method 2
electroless plating to create a wiring conductor
Data Source
AI summary
One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.